WMSIC Electronic Components

ROHM MCR03EZPJ203

ROHM MCR03EZPJ203
1 / 3

Product image

ModelMCR03EZPJ203
Package0603
BrandROHM
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Send RFQ Contact customer service

Technical data

Product details

20 specifications

Core information

Product name
ROHM MCR03EZPJ203
Type
ROHM
Unit
Electronic Component
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
ROHM
Electronic Component
MCR03EZPJ203
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.021g
Electronic Component
20kΩ
Electronic Component
1
Electronic Component
BM0000537107
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±200ppm/℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述：MCR03EZPJ203 - ROHM 贴片电阻

概述

MCR03EZPJ203 是 ROHM（罗姆）公司生产的一款高性能贴片电阻，具有20 kOhm的电阻值，功率额定为0.1W（即100mW），并且具备±5%的容差。这款电阻采用厚膜工艺制造，符合AEC-Q200汽车级标准，适合在汽车及工业应用中要求严苛环境条件下使用。其紧凑的0603封装尺寸（1.60mm x 0.80mm）可以有效降低电路板的占用空间，适合于各种高密度电路设计。

主要特点

  1. 电阻值和容差：

    • MCR03EZPJ203 的额定电阻值为20 kOhm，适合多种电路应用。
    • 容差等级为±5%，保证了电阻的性能在可接受的范围内，有助于提升整个电路的稳定性。

  2. 功率额定：

    • 此电阻的功率额定为0.1W（100mW），此功率级别使其适合在低功耗电路中使用，保障了组件在工作时能有效散热，避免过热导致的故障。

  3. 温度特性：

    • MCR03EZPJ203的温度系数为±200ppm/°C，这表示其电阻值会随着温度变化而变化，这对于高精度应用非常重要。
    • 工作温度范围广泛，从-55°C到155°C，使其在极端环境条件下依然能保持良好的性能，使其特别适用于汽车、航空等要求高的行业。

  4. 封装与安装：

    • 该产品封装为0603，即长0.063英寸（1.60mm），宽0.031英寸（0.80mm），高度为0.022英寸（0.55mm），这些均为标准的表面贴装设备(SMD)封装类型，适合现代电子产品的生产工艺。
    • 显著的封装体积小型化的设计，使其能够有效减少电路板的占用面积，便于高密度集成的布局。

  5. 汽车级认证：

    • MCR03EZPJ203不仅符合AEC-Q200标准，确保了其在汽车行业的应用可靠性，还能在严苛条件下正常工作，尤其适合于高温、低温、潮湿及震动等恶劣环境。

  6. 应用场景：

    • 由于其高稳定性和高可靠性，MCR03EZPJ203广泛应用于汽车电子、工业控制、消费电子等领域。这些应用通常要求电阻具有较高的耐久性和稳定性，以支持长期运行和极端环境下的稳健性能。

结论

MCR03EZPJ203是ROHM公司推出的一款极具竞争力的高性能贴片电阻。凭借其优越的性能参数、极小的封装和汽车级认证，它成为了广大电子设计工程师在寻找适用电阻产品时的首选之一。无论是在汽车、电力、制造，还是在其他高要求领域，这款电阻都能为用户提供可靠的解决方案，确保产品的整体质量和性能。对于追求高性能和高可靠性产品的设计者而言，MCR03EZPJ203是理想的选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.