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ROHM ESR03EZPJ303是一款0603封装厚膜贴片电阻,主打通用精度与宽温适应性,兼顾小型化、可靠性与成本优势。核心聚焦中小功率电路的电阻匹配、分压/限流需求,适配消费电子、工业控制、汽车辅助电路等多场景,是ROHM厚膜电阻系列中的通用型主力产品。
阻值为30kΩ,采用行业标准三位编码标识(303):前两位“30”为有效数字,第三位“3”代表倍率10³,换算后阻值为30×10³=30kΩ。精度标注为**±5%**,属于通用精度等级,可覆盖大多数非高精度电路(如普通信号分压、小电流限流、电源反馈网络),无需额外承担高精度电阻的成本。
功率额定值为250mW(0.25W),是0603封装厚膜电阻的常规功率等级;工作电压最大为150V。需注意功率与电压的匹配关系:当电压达150V时,电流为I=150V/30kΩ=5mA,功耗P=I²R=0.25W,与额定功率完全匹配。实际使用需严格控制电压≤150V或电流≤5mA,避免过功率损坏。
温度系数(TCR)为**±200ppm/℃**,即温度每变化1℃,阻值变化±200×10⁻⁶×30kΩ=±6Ω。典型场景示例:环境温度从25℃升至155℃(变化130℃),阻值变化±780Ω,相对30kΩ的温漂率为±2.6%;结合±5%精度,总误差范围±7.6%,适合对温漂要求不高的电路(如普通开关电路、非精密测量)。
工作温度覆盖**-55℃+155℃**,远超商用级(0℃70℃)与工业级(-40℃~125℃)标准,可稳定工作于汽车发动机舱(高温区域)、工业现场(极端温度)等严苛环境,解决普通电阻高温衰减问题。
该电阻采用0603封装(英制:0.06″×0.03″;公制:1.6mm×0.8mm),属于小型化贴片封装,适配SMT表面贴装工艺,大幅节省电路板空间,满足现代电子设备轻薄化需求。
工艺上采用厚膜技术:通过丝网印刷电阻浆料于陶瓷基板,经高温烧结形成电阻膜,再经电极、封装制成。厚膜工艺兼具成本优势与稳定性,耐温、耐湿、抗振动能力优于部分薄膜电阻,适合批量生产。
ROHM(罗姆)拥有60+年电子元器件研发经验,其厚膜电阻以“稳定可靠、性价比高”著称。ESR03EZPJ303符合IEC、JIS国际标准,提供完整质量证明文件,售后保障完善,供货稳定。
该产品通过平衡参数性能与成本,成为中小功率电路的高性价比选择,尤其适合对温宽、可靠性有要求的通用场景。
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