Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ROHM KTR03EZPF5104
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ROHM KTR03EZPF5104
- Type
- ROHM
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 100mW
- Electronic Component
- Electronic Component
- Electronic Component
- ROHM
- Electronic Component
- KTR03EZPF5104
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.021g
- Electronic Component
- 5.1MΩ
- Electronic Component
- 1
- Electronic Component
- BM0258853308
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 350V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
KTR03EZPF5104 — ROHM 0603 厚膜高阻贴片电阻产品概述
一、产品概述
KTR03EZPF5104 为 ROHM（罗姆）系列的 0603（1608 公制）贴片厚膜电阻，阻值 5.1 MΩ，精度 ±1%。该型号在小封装中实现了高阻值与较高工作电压，适用于高阻抗偏置、输入滤波与高压分压等电路。器件符合商用至工业级温度范围，适配要求可靠性与小尺寸的现代电子系统。
二、主要参数
- 电阻类型：厚膜电阻
- 阻值：5.1 MΩ
- 精度：±1%
- 额定功率：100 mW（封装限制）
- 最大工作电压：350 V
- 温度系数（TCR）：±100 ppm/℃
- 工作温度范围：-55 ℃ ～ +155 ℃
- 封装：0603（1608 公制）
- 品牌：ROHM（罗姆）
三、性能特点
- 高阻值密度：在 0603 小型封装内实现 5.1 MΩ，适合尺寸受限的高阻应用。
- 高电压适应：350 V 的工作电压使其可用于高压分压、偏置网络及输入侧限压场合。
- 稳定性与可重复性：±1% 的精度与 ±100 ppm/℃ 的 TCR 在多数信号与测量场合提供良好的一致性。
- 厚膜工艺特性：成本效益高，抗冲击与可焊性良好；但相较于金属膜产品噪声与长期漂移可能略大。
四、典型应用
- 高阻抗偏置与分压网络（例如放大器输入、电压检测）
- ADC 输入与传感器信号调理中的上拉/下拉电阻
- 显示驱动与测量仪表中需要高阻值的小体积电路
- 汽车电子、工业控制与消费类设备中的高密度布板设计（注意遵守绝缘与爬电距离要求）
五、设计与安装注意事项
- PCB 清洁：高阻值电阻对表面泄漏敏感，焊接后请做好清洗或涂覆防潮绝缘层以减少泄漏电流。
- 裁剪功率与热降额：0603 的 100 mW 为典型额定值，工作时需考虑环境温度对功率的降额与热阻影响。
- 高压布局：在使用近 350 V 的场合，应在 PCB 设计上保留足够爬电/间隙并采用防护措施（如间距、槽切或绝缘涂层）。
- 焊接工艺：采用推荐回流温度曲线，避免过热影响阻值稳定性。贴片电阻无标记，装配时注意料带方向与料号管理。
六、可靠性与采购建议
ROHM 原厂器件具有良好的一致性与批次可追溯性，常以卷装（tape & reel）方式供货，适合 SMT 大批量贴装。对于关键测量或医用/航天等高可靠性场合，建议在样片验证中关注温漂、静态泄漏与长期漂移指标，并与生产方确认 RoHS/环保与可靠性测试结果。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
