WMSIC Electronic Components

ROHM ESR10EZPF30R0

ModelESR10EZPF30R0
Package0805
BrandROHM
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ROHM ESR10EZPF30R0
Type
ROHM
Minimum package
5000 圆盘

Technical parameters

Power
400mW
Electronic Component
Electronic Component
Electronic Component
ROHM
Electronic Component
ESR10EZPF30R0
Electronic Component
1
Package
0805
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.029g
Electronic Component
30Ω
Electronic Component
1
Electronic Component
BM0000537123
Operating Temperature
55℃~+155℃
Operating Voltage
150V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:ESR10EZPF30R0 贴片电阻

一、产品简介

ESR10EZPF30R0是一款由ROHM(罗姆)公司制造的高性能贴片电阻器,广泛应用于汽车电子及其他高可靠性电路设计中。其基本参数为30 Ohms的电阻值,具有±1%的容差,功率额定为0.4W(或2/5W,下文中将指代该功率等级),并且符合AEC-Q200汽车级标准,确保在严苛的工作环境中仍能稳定性得以保证。

二、主要特性

  1. 电气特性:

    • 电阻值:30Ω,适用于各种电压和电流需求的电路。
    • 容差:±1%,确保电阻值在规定范围内,有助于提高电路的精度和稳定性。
    • 功率:0.4W,适合低功率应用,同时可以在相对高的电流下运行,具有良好的散热性能。
    • 温度系数:±100ppm/°C,低温度系数使得电阻在温度变化时的稳定性出色,适合高温或低温环境下的应用。
  2. 机械特性:

    • 封装类型:0805(2012公制),小型化封装设计,便于贴片安装,适应现代电子设备空间有限的需求。
    • 尺寸规格:长度为2.00mm,宽度为1.25mm,最大高度为0.65mm,极为适合高密度布板设计。
    • 端子数:2个端子设计,方便连接到打印电路板(PCB)。
  3. 环境适应性:

    • 工作温度范围:-55°C至155°C,适应极端温度环境,尤其适合汽车和工业设备等对温度有严格要求的应用场合。
    • 防脉冲特性:该电阻设计具有良好的脉冲承受能力,在瞬间高电流情况下亦能维持性能不变,适合电流波动较大的应用。

三、应用领域

ESR10EZPF30R0由于其卓越的性能和可靠性,非常适合以下领域的应用:

  1. 汽车电子:如发动机控制单元(ECU)、车载电脑、传感器及电源管理等组件,尤其在高温、高振动的环境下表现出色。
  2. 工业设备:在各类工控机械、自动化设备中,能够支撑长时间的工作挑战。
  3. 消费电子:在智能手机、平板电脑和其他家用电器中进行电源管理或信号处理。
  4. 医疗设备:用于需要高可信度和稳定性的关键医疗仪器中。
  5. LED驱动电源:用于LED灯的驱动电源中,确保电流稳定,以延长LED的使用寿命。

四、结论

ESR10EZPF30R0贴片电阻的设计充分考虑了现代电子产品在性能、可靠性及耐用性上的需求,尤其适用于高要求的汽车行业及其他工业应用。ROHM作为全球知名的电子元器件制造商,以其优质的产品和优秀的技术支持赢得了广泛的客户信任。选用ESR10EZPF30R0,不仅可提升设备性能,还有助于优化设计,降低故障率。

这种贴片电阻器凭借其高性价比,在工业与消费级产品中都有着极其广泛的应用前景,必将为用户提供更好的电气性能与高效的解决方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.