WMSIC Electronic Components

RALEC RTT0286R6FTH

ModelRTT0286R6FTH
Package0402
BrandRALEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RALEC RTT0286R6FTH
Type
RALEC
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
RALEC
Electronic Component
RTT0286R6FTH
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.009g
Electronic Component
86.6Ω
Electronic Component
10
Electronic Component
BM0265617516
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RTT0286R6FTH 厚膜贴片电阻产品概述

一、产品基本信息

RTT0286R6FTH是台湾旺诠(RALEC)推出的0402封装厚膜贴片电阻,属于通用型被动元件,针对小型化、低功耗电子设备的稳定电阻需求设计。该型号以“0402”(英制尺寸,对应公制1005)为核心封装,结合厚膜工艺的可靠性与旺诠的生产一致性控制,成为消费电子、工业控制等领域的常用选型。

二、核心性能参数详解

该电阻的核心参数精准匹配中小功率电路的典型需求,关键指标如下:

1. 阻值与精度

额定阻值为86.6Ω,精度等级±1%,满足工业级常规信号调理、分压电路的精度要求(无需更高精度的±0.1%或±0.5%时,可有效控制成本)。

2. 功率与电压能力

  • 额定功率62.5mW(0.0625W),实际应用需遵循降额原则(建议负载功率不超过额定值的70%,即43.75mW以下),避免过热导致阻值漂移;
  • 最大工作电压50V,可覆盖大多数低压电路(如5V/12V/24V系统),瞬态电压需额外考虑保护措施。

3. 温度特性

  • 温度系数(TCR)±100ppm/℃,表示温度每变化1℃,阻值变化不超过0.00866Ω(86.6Ω×100ppm),满足一般宽温环境的稳定性;
  • 工作温度范围**-55℃~+155℃**,覆盖汽车电子、工业户外设备的极端温度场景(如车载冬季低温、夏季高温环境)。

4. 封装与可靠性

0402封装体积小(长1.0mm×宽0.5mm),适配主流SMT贴片机,贴装密度高;厚膜工艺采用丝网印刷+高温烧结,抗冲击、抗潮湿性能优于薄膜电阻,长期可靠性稳定。

三、典型适用场景

该电阻的参数特性决定其适合以下场景:

1. 消费电子小型化设备

如智能手环、蓝牙耳机、智能手表的传感器信号调理电路(心率、加速度传感器的滤波/分压),0402封装适配设备内部紧凑空间,62.5mW功率满足低功耗需求。

2. 工业控制模拟电路

工业PLC、传感器模块的模拟量输入/输出电路(如4-20mA信号的采样电阻),±1%精度满足信号转换要求,-55℃~+155℃宽温范围适应工业现场的温度波动。

3. 汽车电子辅助电路

车载USB充电口、仪表盘背光控制的低压辅助电路,50V电压能力覆盖车载12V系统的瞬态过压,厚膜工艺抗汽车振动环境。

4. 通信设备小型模块

基站RRU(射频拉远单元)的偏置电路、光纤收发器的信号滤波,0402封装提升模块集成度,±100ppm/℃温度系数保证信号稳定。

四、品牌与选型优势

1. 旺诠(RALEC)的工艺保障

旺诠作为全球被动元件厂商,厚膜电阻采用高精度丝网印刷技术,阻值一致性控制在±0.2%以内(优于标称±1%),批量应用时无需额外筛选;同时通过AEC-Q200(汽车级)、RoHS(环保)认证,符合国际标准。

2. 封装兼容性与成本平衡

0402封装是行业主流小型化封装,适配所有SMT产线,贴装效率高;相比更高精度(如±0.1%)的薄膜电阻,该厚膜型号成本降低30%以上,适合中低端应用场景。

五、选型与应用注意事项

1. 功率降额设计

实际负载功率需低于额定62.5mW,若电路中存在脉冲信号,需计算峰值功率(脉冲宽度<1ms时,峰值功率可暂时超过额定值,但平均功率需符合降额要求)。

2. 温度环境验证

若应用环境接近155℃,需确认电路板的散热条件(如增加铜箔面积),避免电阻过热导致TCR恶化;低温环境下需注意焊接工艺(避免冷焊)。

3. 贴装工艺要求

0402封装的焊盘尺寸需符合IPC-7351标准(焊盘宽度0.30.35mm,间距0.20.25mm),贴装偏移量需控制在±0.05mm以内,否则可能导致开路或短路。

综上,RTT0286R6FTH是一款高性价比、宽温稳定、小型化的厚膜贴片电阻,精准匹配中小功率、低精度要求的电子电路,是消费电子、工业控制、汽车电子等领域的实用选型。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.