Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RALEC(旺诠)RTT022491FTH是一款专为高密度小型化电路设计的厚膜贴片电阻,核心参数精准匹配精密信号调理、分压限流等场景需求。其关键参数如下:
该产品符合RoHS环保标准,适配SMT自动贴装工艺,是消费电子、汽车电子、工业控制等领域的高性价比选型。
±1%的精度满足大多数精密电路对电阻值的控制要求(如传感器信号放大、基准电压分压)。厚膜工艺的固有稳定性,使长期使用后阻值漂移极小,避免电路信号偏差累积。
额定功率62.5mW,最大工作电压50V,可覆盖低功耗电路的常规场景:
±100ppm/℃的温度系数意味着温度每变化1℃,阻值变化仅0.01%。以工作温度范围(-55℃~+155℃)为例,总阻值变化量约为2.49kΩ×210℃×100ppm=52.3Ω(即2.1%),结合±1%精度,实际应用中阻值偏差仍在可接受范围内,完美适配汽车、工业等极端温度场景(如车载舱内高温、工业现场低温)。
-55℃至+155℃的温度覆盖,超越普通贴片电阻的常规上限(多为+125℃),可在高温存储、低温启动等严苛环境下稳定工作,无需额外降额设计。
RTT022491FTH采用0402封装(公制尺寸:1.0mm×0.5mm,典型厚度0.3mm),体积仅为普通插件电阻的1/20左右,适配高密度PCB设计:
该电阻的性能与封装特性,使其适配以下核心场景:
RALEC(旺诠)是全球知名被动元器件制造商,拥有30余年厚膜电阻研发经验:
RALEC RTT022491FTH厚膜贴片电阻,以小体积、高精度、宽温稳定为核心优势,精准匹配高密度、严苛环境下的电路需求。其性价比突出,适配自动贴装工艺,是消费电子、汽车电子、工业控制等领域的可靠选型,可有效降低客户生产与物料成本。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products