WMSIC Electronic Components

RALEC RTT029760FTH

ModelRTT029760FTH
Package0402
BrandRALEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RALEC RTT029760FTH
Type
RALEC
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
RALEC
Electronic Component
RTT029760FTH
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.009g
Electronic Component
976Ω
Electronic Component
50
Electronic Component
BM0265966491
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RTT029760FTH 厚膜贴片电阻产品概述

RTT029760FTH是旺诠(RALEC) 推出的一款0402封装厚膜贴片电阻,针对低功耗、中精度电路场景设计,以紧凑体积实现精准阻值匹配与宽温稳定性能,是工业控制、便携式电子等领域的实用型元件。

一、产品核心身份与定位

该电阻隶属于旺诠厚膜贴片电阻系列,型号命名直接关联核心参数:

  • RTT:旺诠厚膜贴片电阻的系列标识;
  • 02:封装尺寸代码(对应0402英制封装);
  • 9760:阻值编码(976Ω,末位“0”为有效位数补位);
  • FTH:精度(±1%)、功率(62.5mW)等参数的后缀标识。

其定位为**“小体积中精度厚膜电阻”**,兼顾成本可控与性能稳定,适配高密度PCB设计需求,是量产级电路的常规选型之一。

二、关键电气参数深度解析

该电阻的电气参数针对低功耗场景优化,核心参数及实际意义如下:

2.1 阻值与精度

  • 标称阻值:976Ω(非标准E系列阻值,适合定制化电路匹配,如特定分压比需求);
  • 精度:±1%(满足多数工业/消费类电路的阻值偏差要求,无需额外校准,可直接用于信号调理、电压分压等场景)。

2.2 功率与电压

  • 额定功率:62.5mW(0402封装的典型功率等级,适配低功耗电路,如传感器输出端、蓝牙模块信号路径等);
  • 工作电压:50V(0402封装下的耐压上限,电路设计时需确保电压不超过此值,避免击穿失效)。

2.3 温度特性

  • 温度系数(TCR):±100ppm/℃(计算可知,每1℃变化阻值漂移约0.0976Ω,温漂处于厚膜电阻的偏优水平,长期使用阻值稳定性良好);
  • 工作温度范围:-55℃~+155℃(覆盖工业级宽温要求,甚至可满足部分高温环境应用,如汽车发动机舱周边电路、户外传感器节点)。

三、物理封装与工艺特性

3.1 0402封装尺寸

  • 公制尺寸:1.0mm(长)×0.5mm(宽)×0.3mm(厚);
  • 英制尺寸:0.04″(长)×0.02″(宽);
  • 优势:体积仅为0603封装的1/4,可显著提升PCB布局密度,适配便携式设备(如智能手环、蓝牙耳机)的小型化需求,同时兼容主流回流焊工艺。

3.2 厚膜工艺优势

旺诠采用厚膜丝网印刷+高温烧结工艺,核心特点:

  • 浆料配方优化:阻值一致性好,批量生产时偏差可控(同批次阻值波动小于0.5%);
  • 耐脉冲能力:厚膜电阻比薄膜电阻更耐瞬时脉冲(如电路开关瞬间的浪涌电流,耐受能力约为薄膜的2~3倍);
  • 成本平衡:相比薄膜电阻,厚膜工艺降低了制造成本,适合大规模量产应用。

四、典型应用场景与核心优势

4.1 主要应用场景

  1. 便携式电子:蓝牙模块、智能手环的信号衰减电阻、电压分压电路;
  2. 小型工业控制:PLC的IO模块、温度传感器信号调理电路;
  3. 汽车电子:辅助系统(如胎压监测、车门传感器)的低功耗电路;
  4. 消费类家电:智能插座、遥控器的电压检测电阻、红外接收电路。

4.2 核心优势

  • 高密度适配:0402封装满足小型化设计趋势,可减少PCB面积30%以上;
  • 精准稳定:1%精度+低TCR,避免电路参数偏差导致的信号失真;
  • 宽温可靠:-55~155℃覆盖极端环境,长期使用无明显性能衰减;
  • 成本可控:厚膜工艺平衡性能与价格,单颗成本比同精度薄膜电阻低20%左右;
  • 品牌保障:旺诠作为全球知名电阻厂商,产品一致性与可靠性经过10年以上市场验证,失效概率低于0.1%/千小时。

五、可靠性与环境适应性

该电阻的可靠性满足行业标准,主要体现在:

  • 温度稳定性:宽温范围下阻值漂移率小于0.5%(25℃~155℃),符合工业级产品要求;
  • 耐环境性能:厚膜结构耐湿(85℃/85%RH环境下1000小时阻值变化小于1%)、耐振动(10~2000Hz振动测试无失效);
  • 焊接可靠性:端电极采用镍/锡镀层,兼容回流焊工艺,焊接脱落率低于0.05%;
  • 环保合规:符合RoHS、REACH等环保指令,无铅无镉,适配全球市场需求。

总结

RTT029760FTH是旺诠针对小功率、中精度场景打造的0402厚膜贴片电阻,以紧凑体积实现精准阻值、宽温稳定与成本可控的平衡,覆盖便携式电子、工业控制、汽车电子等多领域应用,是高密度电路设计的实用选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.