WMSIC Electronic Components

RALEC RTT02334JTH

ModelRTT02334JTH
Package0402
BrandRALEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RALEC RTT02334JTH
Type
RALEC
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
RALEC
Electronic Component
RTT02334JTH
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.009g
Electronic Component
330kΩ
Electronic Component
50
Electronic Component
BM0265147792
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RTT02334JTH厚膜贴片电阻产品概述

一、产品定位与品牌背景

RTT02334JTH是RALEC旺诠推出的0402封装厚膜贴片电阻,属于旺诠常规电阻产品线的基础型号,主打「高性价比+稳定可靠性」,覆盖消费电子、工业控制等多领域的常规电路需求。旺诠作为专业被动元件制造商,其厚膜电阻采用成熟的丝网印刷工艺,结合陶瓷基片与端电极优化设计,在小型化封装下平衡了性能与成本。

二、核心电气性能参数

该型号关键参数明确适配常规应用场景:

  • 阻值:330kΩ(电阻代码「334」,即33×10⁴Ω),为电路中常见的分压、限流阻值;
  • 精度:±5%(E24系列精度),满足非高精度需求(如信号偏置、电源反馈);
  • 额定功率:62.5mW(0.0625W),适配0402封装功率承载能力,实际功耗需≤此值;
  • 额定电压:50V,为电阻两端允许施加的最大直流/交流电压(需与功率双重校验:U=50V时,电流≈151.5μA,功耗≈7.57mW,远低于额定功率);
  • 温度系数(TCR):±100ppm/℃,即温度每变1℃,阻值变化33Ω;-55℃至155℃范围内,总阻值变化≈6930Ω,仍在±5%精度(16.5kΩ)以内,稳定性可靠。

三、物理封装与结构特点

RTT02334JTH采用0402封装(英制0.04″×0.02″,公制1005封装),核心结构优势:

  • 体积紧凑:适合高密度PCB布局(如智能手机、智能穿戴主板);
  • 厚膜工艺:以氧化铝陶瓷基片为载体,丝网印刷电阻浆料形成电阻层,表面涂环氧树脂保护漆;端电极采用「镍底层+锡表层」三层结构,提升焊接性与抗硫化能力;
  • 机械强度:陶瓷基片耐回流焊热应力,不易开裂或阻值漂移。

四、环境适应性表现

参数覆盖多数常规场景需求:

  • 工作温度:-55℃至+155℃,支持工业级环境(户外传感器、PLC)及高温场景(充电器、车载电子低温启动);
  • 耐湿性:60℃/95%RH环境下1000小时阻值变化≤1%,适配潮湿地区;
  • 抗硫化:镍层隔离银浆与硫化气体,降低含硫环境(部分工业场所)的开路风险。

五、典型应用场景

  1. 消费电子:智能手机/平板的信号调理(麦克风偏置、触控驱动)、电源反馈电阻;
  2. 工业控制:PLC输入输出接口、传感器信号放大偏置电阻;
  3. 汽车电子:车载信息娱乐系统辅助电路(按键背光限流,需确认温度合规);
  4. 通信设备:小型路由器/交换机的电源滤波电阻。

六、选型与使用注意事项

  1. 功率电压匹配:需同时满足U≤50V、P≤62.5mW,避免过压/过功率烧毁;
  2. 精度适配:需±1%精度(如精密测量),选对应型号(如RTT02334FTH);
  3. 焊接工艺:0402建议回流焊,手工焊控温≤350℃、时间≤3秒;
  4. 存储条件:常温(15-35℃)、干燥(湿度≤60%RH),避免受潮影响焊接;
  5. 静电防护:虽抗静电优于薄膜电阻,仍需遵循ESD规范。

RTT02334JTH凭借小型化、稳定可靠的特性,成为常规电路设计的高性价比选择,适用于对精度、功率要求适中的多数电子设备。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.