Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
RALEC RTA03-4D512JTP RTA03
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
13
specifications
Core information
- Product name
- RALEC RTA03-4D512JTP
- Type
- RALEC
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- RALEC
- Electronic Component
- RTA03-4D512JTP
- Electronic Component
- 1
- Package
- 0603x4
- Electronic Component
- 0.03g
- Electronic Component
- 1
- Electronic Component
- BM0265746261
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RTA03-4D512JTP 产品概述
1. 产品简介
RTA03-4D512JTP 是一款由 RALEC（旺诠）公司生产的高精度排阻，广泛应用于各种电子电路中。该排阻具有四个独立的电阻器，每个电阻器的阻值为 5.1kΩ，精度为 ±5%，功率为 62.5mW。其封装形式为 1206，适合在紧凑的电路板上使用。
2. 主要参数
- 电阻值: 5.1kΩ
- 精度: ±5%
- 功率: 62.5mW
- 温度系数: ±200ppm/℃
- 引脚数: 8
- 电阻器数: 4
- 封装: 1206
- 品牌: RALEC（旺诠）
3. 产品特点
- 高精度: 该排阻的精度为 ±5%，能够满足大多数电子电路对电阻精度的要求。
- 紧凑封装: 采用 1206 封装，适合在空间有限的电路板上使用。
- 稳定性好: 温度系数为 ±200ppm/℃，在温度变化较大的环境下仍能保持稳定的电阻值。
- 多电阻器设计: 内置四个独立的电阻器，方便在电路设计中实现多路电阻匹配。
4. 应用场景
RTA03-4D512JTP 适用于多种电子设备和电路，包括但不限于：
- 消费电子产品: 如智能手机、平板电脑、笔记本电脑等。
- 工业控制设备: 如 PLC、传感器、电机控制器等。
- 通信设备: 如路由器、交换机、基站等。
- 汽车电子: 如车载娱乐系统、导航系统、车身控制模块等。
5. 技术规格
- 电阻值: 5.1kΩ
- 精度: ±5%
- 功率: 62.5mW
- 温度系数: ±200ppm/℃
- 引脚数: 8
- 电阻器数: 4
- 封装: 1206
- 品牌: RALEC（旺诠）
6. 使用注意事项
- 焊接温度: 建议使用适当的焊接温度，避免过高的温度损坏排阻。
- 存储环境: 应存放在干燥、无尘的环境中，避免潮湿和腐蚀性气体。
- 电气参数: 在使用前应仔细核对电气参数，确保符合电路设计要求。
7. 总结
RTA03-4D512JTP 是一款高性能、高精度的排阻，适用于多种电子设备和电路。其紧凑的封装和稳定的性能使其成为电子设计中的理想选择。无论是消费电子产品、工业控制设备还是汽车电子，RTA03-4D512JTP 都能提供可靠的电阻解决方案。
通过以上概述，相信您对 RTA03-4D512JTP 有了更深入的了解。如需进一步的技术支持或购买咨询，请联系 RALEC（旺诠）公司或其授权代理商。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
