WMSIC Electronic Components

RALEC RTT021073FTH

ModelRTT021073FTH
Package0402
BrandRALEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RALEC RTT021073FTH
Type
RALEC
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
RALEC
Electronic Component
RTT021073FTH
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.009g
Electronic Component
107kΩ
Electronic Component
10
Electronic Component
BM0265147742
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RTT021073FTH(RALEC旺诠)0402封装厚膜贴片电阻产品概述

一、产品基本信息

RTT021073FTH是RALEC(旺诠) 推出的一款0402封装厚膜贴片电阻,属于小功率、常规精度被动元件系列。该产品采用成熟的厚膜烧结工艺,适配表面贴装技术(SMT),可满足自动化量产需求,广泛应用于消费电子、工业控制、通信设备等领域,是高密度PCB设计的理想选择。

二、核心电气性能参数

该电阻的关键电气指标明确,覆盖小信号电路的核心需求:

  1. 阻值与精度:标称阻值107kΩ,精度±1%,满足多数电路对阻值偏差的控制要求(如信号分压、滤波、限流等场景);
  2. 功率与电压:额定功率62.5mW,最大工作电压50V;需注意高温环境下需按厚膜电阻常规降额曲线调整(如125℃时功率降额至约40%);
  3. 温度系数:±100ppm/℃,即温度每变化1℃,阻值变化±107Ω;在-55℃~+155℃范围内,最大阻值漂移约1.39kΩ(温差130℃),稳定性符合工业级应用标准;
  4. 工作温度范围:-55℃至+155℃,覆盖极端环境(如户外设备、高温工业场景)的使用需求。

三、封装与物理特性

  1. 封装类型:0402(英制),对应公制1005,尺寸为1.0mm(长)×0.5mm(宽)×0.35mm(高),体积小、重量轻,可显著节省PCB空间;
  2. 贴装兼容性:表面贴装设计,支持回流焊、波峰焊等自动化工艺,贴装效率高,适合大规模量产;
  3. 焊接可靠性:无引脚焊盘结构,通过两端金属焊盘与PCB焊接,抗振动、抗冲击性能优于插件电阻,适合移动设备(如无人机、手持终端)使用。

四、适用场景与应用领域

结合参数特性,该电阻主要适用于以下场景:

  1. 消费电子:智能手机、平板电脑的音频信号调理、传感器滤波电路;
  2. 工业控制:小型PLC、温度传感器模块的分压、限流电路(适配宽温环境);
  3. 通信设备:小型基站、路由器的信号链路电阻(高密度封装需求);
  4. 汽车电子:车载小功率辅助电路(如仪表盘背光控制、传感器信号处理,需注意匹配汽车级认证)。

五、可靠性与环境适应性

  1. 工艺稳定性:厚膜烧结工艺使阻值一致性好,批次间偏差小,降低电路调试难度;
  2. 环境测试:通过高低温循环、湿热(85℃/85%RH)、振动(10~2000Hz)等可靠性测试,符合电子元器件行业标准;
  3. 长期可靠性:额定功率下长期工作(1000小时)阻值漂移≤0.5%,满足量产设备的使用寿命要求。

六、品牌与工艺优势

RALEC(旺诠)作为全球知名被动元件供应商,该产品具备以下优势:

  1. 品质管控:全流程自动化生产+严格的出厂测试,确保每批次产品参数一致;
  2. 环保认证:符合RoHS、REACH等欧盟环保标准,无铅焊接兼容;
  3. 供货能力:成熟的产能布局,可稳定满足中小批量至大规模量产需求。

综上,RTT021073FTH以小体积、宽温范围、稳定的电气性能,成为高密度电子设备中常规电阻的高性价比选择,适配多领域的量产应用需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.