WMSIC Electronic Components

RALEC RTT02363JTH

ModelRTT02363JTH
Package0402
BrandRALEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RALEC RTT02363JTH
Type
RALEC
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
RALEC
Electronic Component
RTT02363JTH
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.009g
Electronic Component
36kΩ
Electronic Component
50
Electronic Component
BM0259545532
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RTT02363JTH产品概述

一、产品简介

RTT02363JTH 为 RALEC(旺诠)系列贴片厚膜电阻,封装为 0402(公制 1005 英制),标称阻值 36kΩ,阻值精度 ±5%。该器件针对高密度表贴电路设计,体积小、可靠性高,适用于移动终端、传感器前端、电源分压与信号调理等场合。

二、主要电气与环境参数

  • 电阻类型:厚膜电阻
  • 阻值:36 kΩ
  • 精度:±5%(J 级)
  • 额定功率:62.5 mW(在规定环境条件下)
  • 最大工作电压:50 V
  • 温度系数(TCR):±100 ppm/℃
  • 工作温度范围:-55 ℃ ~ +155 ℃

三、产品特性与优势

  • 小尺寸(0402)利于高密度布局与微型化产品设计;
  • 厚膜制程成本效益好,制造稳定性高;
  • ±100 ppm/℃ 的温度系数在多数模拟与数字电路中能提供较好的温度稳定性;
  • 62.5 mW 的功率等级在低功耗分压、偏置与滤波电路中足够使用;
  • RALEC(旺诠)品牌供应链稳定,适合批量生产与配套采购。

四、典型应用场景

  • 手机与可穿戴设备的分压、偏置网络;
  • 传感器信号调理与滤波电路;
  • 低功率模拟电路与参考网络;
  • 一般电子产品的阻值取样与电压检测回路;
  • 高密度 PCB 的表贴应用。

五、使用与设计建议

  • 请根据实际工作温度对功率进行降额设计,避免在高温下长期接近额定功率运行;
  • 在接近最大工作电压(50 V)时注意器件的自发热与周围元件的热耦合;
  • 若电路对阻值精度或温漂有较高要求,可考虑并联/串联匹配或选用更高精度/低 TCR 的型号;
  • 推荐遵循厂商回流焊曲线进行焊接,避免超出热循环极限以保障可靠性。

六、封装、包装与可靠性

  • 封装:0402 表贴;便于自动贴片与回流焊接;
  • 包装方式:常见为卷盘(Reel)包装,利于 SMT 贴装与料盘补给;
  • 可靠性:厚膜结构对常规焊接与环境应力具有良好耐受性,适配民用与工业级温度范围(-55 ℃ 至 +155 ℃)。

七、选型与采购提示

  • 型号标识:RTT02363JTH,品牌 RALEC(旺诠);
  • 采购时请核对阻值、精度、封装及环境规格,确认供货的包装形式与熔点兼容的回流焊工艺参数;
  • 如需更高精度或更低温漂的替代方案,可咨询供应商获取相近封装的薄膜或金属膜电阻型号。

如需本型号的详细资料表(Datasheet)、回流焊曲线或可靠性测试数据,我可以进一步为您提供或协助联系供应渠道。

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