WMSIC Electronic Components

RALEC RTT021372FTH

ModelRTT021372FTH
Package0402
BrandRALEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RALEC RTT021372FTH
Type
RALEC
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
RALEC
Electronic Component
RTT021372FTH
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.009g
Electronic Component
13.7kΩ
Electronic Component
10
Electronic Component
BM0265144984
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RTT021372FTH厚膜贴片电阻产品概述

RTT021372FTH是RALEC(旺诠) 推出的一款0402封装厚膜贴片电阻,针对高密度小型化电子设备的常规电路设计,兼顾阻值精度、功率容量与宽温适应性,是工业及消费电子领域的实用基础元件。

一、产品基本属性

该型号属于旺诠厚膜贴片电阻系列,核心属性明确:

  • 品牌:RALEC(旺诠),台湾知名被动元件制造商,产品以稳定工艺和性价比著称;
  • 产品类型:厚膜贴片电阻,采用陶瓷基底+厚膜电阻浆料烧结工艺;
  • 封装规格:0402(英制封装代码),对应公制尺寸1005(长度1.016mm×宽度0.508mm),厚度约0.3mm;
  • 型号标识:RTT021372FTH,其中“02”对应0402封装,“1372”表示阻值13.7kΩ(前三位137,第四位2为×10²倍率)。

二、核心电气参数

RTT021372FTH的关键性能可满足多数常规电路需求:

  • 阻值与精度:标称阻值13.7kΩ(13700Ω),精度±1%,实际阻值范围为13.563kΩ~13.837kΩ,覆盖信号调理、分压、限流等场景的阻值控制;
  • 额定功率:62.5mW(0.0625W),为最大允许耗散功率,实际工作功率不得超过此值;
  • 电压限制:标注最大工作电压50V,但需结合功率验证实际上限:( U_{max} = \sqrt{P×R} ≈ 29.3V ),应用中需控制电压不超29.3V,避免过载;
  • 温度系数(TCR):±100ppm/℃,每变化1℃阻值变化约±1.37Ω,满足中温环境稳定性;
  • 工作温度范围:-55℃~+155℃,覆盖工业级宽温场景,适配高低温交替环境。

三、封装与物理特性

0402封装适配高密度PCB布局:

  • 尺寸:英制0402(0.04英寸长×0.02英寸宽),公制1005(1.0mm×0.5mm),厚度约0.3mm;
  • 焊接兼容性:支持回流焊、波峰焊等常规贴片工艺,焊接峰值温度符合行业标准(240℃左右);
  • 电极设计:两端采用镍/锡镀层,保证焊接可靠性与抗氧化性。

四、材料与工艺优势

厚膜工艺赋予该型号实用价值:

  • 基底材料:高纯度氧化铝陶瓷,热稳定性好,可承受高温烧结与环境温度变化;
  • 电阻层:钌基厚膜浆料经丝网印刷、高温烧结形成致密层,阻值一致性佳;
  • 性价比:相比薄膜电阻成本更低,适合批量应用;
  • 耐环境性:厚膜结构对湿度、灰尘耐受性优于薄膜电阻,长期可靠性高。

五、典型应用场景

该型号适配以下场景:

  1. 小型化消费电子:智能手机、智能手表的信号调理(音频放大、射频匹配)、电源分压电路;
  2. 工业传感器模块:温度/压力传感器的信号放大阻值匹配、数据采集模块限流电阻;
  3. 车载电子(低温场景):车载中控、仪表盘小功率控制电路(温度不超155℃);
  4. 通信设备:小型基站、蓝牙模块的射频辅助电路、电源滤波电路。

六、选型与使用注意事项

为保证可靠性,需注意:

  1. 功率匹配:实际功率≤62.5mW,若需更高功率(如100mW),更换0603封装(1/10W);
  2. 电压控制:实际电压≤29.3V,避免过载;
  3. 温度环境:超-55℃~+155℃需选宽温级型号;
  4. 精度升级:需±0.1%精度时,更换薄膜贴片电阻(如旺诠RT系列)。

总结

RTT021372FTH是旺诠针对常规电路的高性价比厚膜电阻,0402封装实现小型化布局,±1%精度满足多数需求,宽温范围适配工业环境,是消费电子、工业控制等领域的实用选型,兼具成本优势与稳定性能。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.