WMSIC Electronic Components

RALEC RTA03-4D104JTP RTA03

ModelRTA03-4D104JTP
Package1206
BrandRALEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RALEC RTA03-4D104JTP
Type
RALEC
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RALEC
Electronic Component
RTA03-4D104JTP
Electronic Component
1
Package
1206
Electronic Component
Resistor Array
Electronic Component
±5%
Electronic Component
0.03g
Electronic Component
100kΩ
Electronic Component
8
Electronic Component
1
Electronic Component
BM0265114425
Electronic Component
±200ppm/℃
Resistor
4
Power
62.5mW
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RALEC RTA03-4D104JTP 贴片排阻产品概述

一、产品基本定位

RALEC(旺诠)RTA03-4D104JTP是一款4通道集成贴片排阻,专为高密度电路设计打造,将4个独立电阻单元集成于紧凑封装内,兼顾小型化、一致性与成本优势,广泛适配消费电子、工业控制、通信等领域的信号调理与电源分压场景。

二、核心参数详解

该排阻的关键性能参数明确,可满足常规工程设计需求:

  1. 电阻配置:内置4个独立电阻,单电阻阻值为100kΩ(标识代码“104”对应10×10⁴Ω),无公共端设计,支持电路中独立或组合使用;
  2. 精度等级:阻值精度为**±5%**(标识代码“J”代表5%精度),符合工业级常规信号处理的误差要求;
  3. 功率容量:单个电阻单元的额定功率为62.5mW,可稳定承载低功耗电路的功率需求;
  4. 温度特性:温度系数为**±200ppm/℃**,即温度每变化10℃,阻值偏差约±0.2%,在-55℃~125℃工作温度范围内表现稳定;
  5. 封装尺寸:每个电阻单元为0603封装(英制,对应公制1608),排阻整体采用1206标准贴片封装(3.2mm×1.6mm),兼容主流SMT贴装设备;
  6. 引脚数量:共8引脚,采用单列布局,每个电阻对应相邻两个引脚(如引脚1-2、3-4、5-6、7-8分别为4个电阻的两端),便于电路设计与焊接。

三、封装与引脚设计

  1. 封装特点:1206封装是贴片元件的主流规格之一,体积小(约3.2×1.6×0.8mm),可有效节省PCB空间,尤其适合便携设备的高密度布局;
  2. 引脚布局:8引脚单列设计,引脚间距为1.27mm(标准贴片引脚间距),焊接可靠性高,不易出现虚焊问题;
  3. 环保认证:符合RoHS 2.0与REACH环保标准,无铅无卤,适配绿色制造需求。

四、典型应用场景

该排阻的性能参数匹配多领域的低功耗电路需求,主要应用包括:

  1. 消费电子:智能手机、平板、智能手表等便携设备的电源分压电路、音频信号衰减网络;
  2. 工业控制:PLC模块、传感器接口的信号调理电路(如电压采样、电流限制);
  3. 通信设备:路由器、交换机的信号匹配网络、偏置电路;
  4. 智能家居:智能音箱、安防摄像头的辅助控制电路、状态指示电路;
  5. 汽车电子:车载中控的低功耗辅助电路(如按键背光分压、传感器信号滤波)。

五、性能优势总结

相比4个独立0603电阻,RTA03-4D104JTP具备以下优势:

  1. 空间节省:集成4个电阻于1206封装,PCB占用面积减少约40%,提升电路布局密度;
  2. 一致性优异:同一排阻内的4个电阻由同批次工艺制造,阻值偏差、温度系数一致性优于独立电阻,降低电路整体误差;
  3. 装配效率高:SMT贴装一次完成4个电阻的装配,减少贴装时间与人工成本,提升生产效率;
  4. 可靠性稳定:旺诠成熟的薄膜电阻工艺,确保长期使用中阻值漂移小,耐温性能满足回流焊(260℃/10s)要求;
  5. 成本优化:集成化降低采购成本与库存管理成本,适合批量应用场景。

该产品凭借紧凑设计与稳定性能,成为高密度电路设计中替代独立电阻的优选方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.