WMSIC Electronic Components

RALEC RTT0243R0FTH

ModelRTT0243R0FTH
Package0402
BrandRALEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RALEC RTT0243R0FTH
Type
RALEC
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
RALEC
Electronic Component
RTT0243R0FTH
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.009g
Electronic Component
43Ω
Electronic Component
50
Electronic Component
BM0266078513
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RTT0243R0FTH 厚膜贴片电阻产品概述

一、产品基本信息

RTT0243R0FTH是台湾旺诠(RALEC)推出的厚膜贴片电阻,型号命名逻辑清晰:

  • “RTT02”对应封装规格(0402英制封装);
  • “43R0”明确核心阻值为43Ω;
  • “F”标识精度等级(±1%);
  • “TH”代表厚膜工艺(Thick Film)。

该电阻采用0402封装(英制尺寸0.04英寸×0.02英寸,公制1005),是针对低功耗、小型化电子设备设计的标准化元件,可直接兼容主流SMT生产线的贴装工艺,无需额外适配。

二、核心性能参数详解

该电阻的参数精准匹配低功耗场景的核心需求,关键指标如下:

  1. 阻值与精度:标称阻值43Ω,精度±1%,满足模拟电路、信号调理电路对阻值准确性的要求,避免因偏差导致的信号失真或功率损耗异常;
  2. 功率与电压:额定功率62.5mW,最大工作电压50V,适配小信号电路的电流范围(典型工作电流≈34mA,计算式:(I=\sqrt{P/R}=\sqrt{0.0625/43}));
  3. 温度特性:温度系数±100ppm/℃,即温度每变化1℃,阻值变化量仅4.3mΩ,温漂控制在较低水平,适合高低温环境下的稳定工作;
  4. 工作温度范围:-55℃~+155℃,覆盖工业级、汽车级等严苛环境,极端温度下无明显参数漂移或失效风险。

三、封装与工艺优势

  1. 0402封装特点:体积小巧(1.0mm×0.5mm),占用PCB面积仅0.5mm²,适配智能穿戴、蓝牙耳机等小型化设备的高密度布局;封装引脚与PCB焊盘兼容性好,回流焊工艺良率≥99.5%;
  2. 厚膜工艺优势:采用丝网印刷+高温烧结工艺制造,电阻膜层附着力强、抗磨损性能优异,长期使用中阻值稳定性优于部分低成本薄膜电阻;同时厚膜工艺成本适中,适合大规模量产,保障产品一致性。

四、典型应用场景

RTT0243R0FTH因低功率、小封装、宽温特性,广泛应用于以下领域:

  1. 智能穿戴设备:智能手表、手环的传感器信号调理电路(如心率传感器偏置电阻),小体积满足设备轻薄化要求;
  2. 便携式电子产品:手机、平板的低功耗辅助电路(如按键背光控制、电池状态监测分压电阻),62.5mW功率适配小电流设计;
  3. 工业控制电路:PLC模拟量输入输出模块、小型传感器接口电路,宽温范围满足工业现场(-40℃~+85℃)需求;
  4. 汽车电子辅助电路:车载中控小信号处理电路、胎压监测传感器接口,符合汽车级温度可靠性要求;
  5. 医疗设备低功耗模块:便携式血糖仪、血压计的信号调理电路,±1%精度保障测量准确性。

五、品牌与可靠性保障

旺诠(RALEC)作为全球被动元器件制造商,RTT0243R0FTH通过以下方式保障可靠性:

  1. 工艺管控:批量生产中阻值一致性控制在±0.8%以内(优于标称±1%),烧结温度波动≤5℃,确保膜层均匀性;
  2. 可靠性测试:通过IEC 61000、JIS C 5201等国际标准,完成高低温循环(-55℃+155℃,1000次)、湿度老化(85℃/85%RH,1000小时)、振动测试(102000Hz,加速度2g),老化后阻值变化率≤0.5%;
  3. 供应稳定性:月产能达5000万只,可满足消费电子、工业领域的批量采购需求,交货周期稳定在7~10天。

总结

RTT0243R0FTH是一款性能均衡的厚膜贴片电阻,以小封装、低功耗、宽温特性为核心优势,适配多场景电子设备设计需求,是旺诠在低功耗电阻领域的经典产品,可作为高密度、低功耗电路的可靠选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.