Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
RALEC RTT05204JTP
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- RALEC RTT05204JTP
- Type
- RALEC
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 125mW
- Electronic Component
- Electronic Component
- Electronic Component
- RALEC
- Electronic Component
- RTT05204JTP
- Electronic Component
- 1
- Package
- 0805
- Electronic Component
- SMD Resistor
- Electronic Component
- ±5%
- Electronic Component
- 0.027g
- Electronic Component
- 200kΩ
- Electronic Component
- 1
- Electronic Component
- BM0265147692
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 150V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RTT05204JTP 厚膜贴片电阻产品概述
一、产品基本定位
RTT05204JTP是台湾旺诠电子（RALEC）推出的一款0805封装厚膜贴片电阻，属于常规功率型被动元器件。该型号以「成本可控+稳定性优先」为设计核心，适配多数中低功率电子电路的分压、限流、滤波等基础应用，是消费电子、工业控制、汽车电子等领域的通用选型。
二、核心技术参数详解
该电阻的参数明确支撑其应用场景，关键指标如下：
- 阻值与精度：标称阻值200kΩ，精度±5%——无需高精度电阻的成本投入，可满足8位单片机外围电路、普通传感器信号调理等常规精度要求；
- 功率与电压：额定功率125mW（即1/8W），最大工作电压150V——适合低压直流（5V/12V系统）或小信号交流电路，避免功率过载风险；
- 温度特性：温度系数±100ppm/℃——环境温度每变化1℃，阻值漂移不超过0.01%，在宽温范围内保持稳定；
- 工作温度范围：-55℃至+155℃——覆盖工业级高低温场景（如户外设备、汽车高温区域），无需额外温控措施即可稳定工作。
三、封装与生产适配性
RTT05204JTP采用标准0805贴片封装（公制尺寸约2.0mm×1.25mm×0.5mm），完全兼容常规SMT自动化生产线，贴装效率高，适合批量生产。封装设计紧凑，可有效节省PCB板空间，尤其适用于小型化电子设备（如智能穿戴、便携式仪器）。
四、典型应用场景
结合参数特性，该电阻主要适用于以下场景：
- 消费电子：手机/平板的充电保护电路、音频滤波电路，以及智能家电的控制模块；
- 工业控制：小型PLC的输入输出接口、传感器信号调理电路（如温度传感器的分压电阻）；
- 汽车电子：车载中控辅助电路、低温区传感器（胎压监测）外围电阻，适配汽车级温度要求；
- 通信设备：路由器/交换机的电源滤波电路，满足小功率、宽温稳定需求。
五、可靠性与品质保障
旺诠作为专业被动元器件制造商，RTT05204JTP具备以下品质优势：
- 厚膜工艺优势：采用丝网印刷+烧结工艺，阻值一致性好，抗湿性、耐腐蚀性优于薄膜电阻，长期使用阻值漂移小；
- 环保合规：符合RoHS 2.0、REACH等标准，不含铅、镉等有害物质，适配全球市场；
- 批量稳定性：生产执行ISO 9001体系，每批次参数偏差控制在规格内，适合大规模采购。
六、选型与采购注意事项
- 功率匹配：若电路实际功率超过125mW，需并联电阻或选用更高功率型号；
- 精度适配：±5%精度仅适用于常规电路，若需1%高精度，需更换其他型号；
- 环境防护：虽宽温，但极端潮湿（水下）或高辐射场景需额外防护措施。
该型号凭借「成本可控+宽温稳定+批量适配」的特性，成为中低端电子设备被动元器件的常用选型，可满足多数常规电路的基础需求。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
