WMSIC Electronic Components

RALEC RTA03-4D22R0FTP RTA03

ModelRTA03-4D22R0FTP
Package0603x4
BrandRALEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

14 specifications

Core information

Product name
RALEC RTA03-4D22R0FTP
Type
RALEC
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RALEC
Electronic Component
RTA03-4D22R0FTP
Electronic Component
1
Package
0603x4
Electronic Component
Resistor Array
Electronic Component
0.031g
Electronic Component
1
Electronic Component
BM0265966510
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RALEC旺诠RTA03-4D22R0FTP 排阻产品概述

RALEC(旺诠)作为台湾老牌被动元器件厂商,其RTA03-4D22R0FTP是一款专为高密度电路设计的4联片式排阻,集成4个22Ω高精度电阻,凭借紧凑封装、稳定性能适配多领域应用需求。

一、产品定位与核心优势

该排阻核心定位为小体积高精度集成电阻,解决单电阻分散布局的空间浪费与布线复杂问题,核心优势体现在三方面:

  1. 空间效率提升:采用4D03(0603×4)封装,尺寸仅为4个独立0603电阻组合的1/3左右,大幅压缩PCB占用面积;
  2. 精度与一致性:单电阻精度±1%,批次一致性优于±0.5%(实际生产管控),避免多电阻分散带来的阻值偏差累积;
  3. 布线简化:8引脚集成设计,4个电阻的公共端与独立端集中引出,减少PCB走线数量,降低设计复杂度。

二、关键参数深度解析

2.1 电阻核心性能

  • 数量与阻值:内置4个22Ω固定电阻,采用薄膜工艺制造,阻值一致性可控在±0.5%以内,满足信号调理的准确需求;
  • 精度与功率:单电阻精度±1%,额定功率62.5mW,4个电阻可同时稳定工作在额定功率下(无串并联功率叠加限制),实际应用建议留50%余量(≤31.25mW);
  • 温度特性:温度系数±200ppm/℃,即温度每变化100℃,阻值漂移约0.44Ω(22Ω×100℃×200e-6),远低于碳膜电阻的500ppm/℃,适合-55℃~125℃宽温环境。

2.2 封装与引脚设计

  • 封装类型:4D03(0603×4),符合IPC标准的表面贴装封装,兼容回流焊(260℃峰值10秒)、波峰焊工艺;
  • 引脚布局:8引脚单列SMD设计,通常包含1个公共端与4个独立输出端,便于电路中多通道电阻网络的快速连接,焊盘间距0.5mm适配常规PCB设计。

三、典型应用场景

RTA03-4D22R0FTP因小体积、高精度特性,广泛适配以下场景:

  1. 消费电子:手机/平板的按键矩阵分压电路(4个电阻分别对应4个按键,公共端接参考电压,避免按键误触发);
  2. 工业控制:传感器信号调理电路的限流电阻(如热电偶信号放大前的小电流限流,防止过流损坏运放);
  3. 通信设备:射频前端的匹配网络(4个22Ω电阻组成小型匹配网络,优化信号传输效率);
  4. 汽车电子:辅助电路的电压分压(如仪表盘指示灯的分压控制,满足宽温工作需求)。

四、可靠性与工艺保障

RALEC对该产品采用成熟的薄膜电阻制造工艺,保障长期稳定性:

  • 耐温性能:工作温度范围-55℃125℃,存储温度-65℃150℃,满足汽车、工业场景的宽温要求;
  • 焊接兼容性:可承受260℃回流焊峰值温度(持续10秒),无封装开裂、引脚脱落问题;
  • 长期稳定性:经1000小时高温老化测试,阻值变化≤0.1%,部分批次符合AEC-Q200汽车级标准。

五、选型与使用注意事项

  1. 功率余量:实际应用中单个电阻功率需低于62.5mW(建议留50%余量),避免过功率导致阻值漂移;
  2. 封装匹配:PCB焊盘需按照4D03封装尺寸设计(典型焊盘尺寸0.6mm×0.3mm),确保焊接牢固;
  3. 静电防护:片式电阻对ESD敏感,存储与焊接需采用防静电措施(如防静电包装、接地工作台)。

这款排阻凭借RALEC的工艺积累与紧凑设计,成为高密度电路中替代多独立电阻的优选方案,适配从消费电子到工业控制的多领域需求。

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