WMSIC Electronic Components

RALEC RTT06104JTP

ModelRTT06104JTP
Package1206
BrandRALEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RALEC RTT06104JTP
Type
RALEC
Minimum package
5000 圆盘

Technical parameters

Power
250mW
Electronic Component
Electronic Component
Electronic Component
RALEC
Electronic Component
RTT06104JTP
Electronic Component
1
Package
1206
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.03g
Electronic Component
100kΩ
Electronic Component
1
Electronic Component
BM0265577600
Operating Temperature
55℃~+155℃
Operating Voltage
150V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RALEC旺诠RTT06104JTP厚膜电阻产品概述

RTT06104JTP是RALEC旺诠推出的1206封装厚膜贴片电阻,针对工业级常规电路需求设计,平衡了性能稳定性、成本控制与贴装兼容性,广泛应用于信号调理、分压、滤波及电路保护等场景。

一、产品基本定位与核心身份

该电阻属于旺诠工业级常规厚膜电阻系列,采用贴片式1206封装(公制尺寸1.6×0.8mm),是传统插件电阻的高效替代方案,适配自动化SMT生产,满足中小功率电路的可靠性需求。

二、关键电气与物理参数解析

1. 阻值与精度

  • 标称阻值:100kΩ(10^5Ω),属于电子电路中常见的分压/偏置阻值;
  • 精度等级:±5%,适用于非高精度需求场景(如信号分压、电源滤波),避免过度精度导致的成本浪费。

2. 功率与电压

  • 额定功率:250mW(0.25W),可承载持续工作电流约1.67mA(V=IR=100kΩ×1.67mA);
  • 工作电压:150V(AC/DC),需注意功率与电压的乘积不超过额定功率(如150V下最大电流≤1.67mA)。

3. 温度特性

  • 温度系数(TCR):±100ppm/℃,即温度每变化1℃,阻值漂移±0.01%;
  • 工作温度范围:-55℃~+155℃,覆盖工业级环境(如工业现场高温、车载低温)的温度要求。

4. 封装与尺寸

  • 封装类型:1206(英制0610,对应公制1.6mm×0.8mm×0.45mm典型高度);
  • 贴装兼容性:符合IPC标准,适配常规SMT贴装设备,支持高速生产。

三、核心技术特点与优势

1. 厚膜工艺的平衡优势

采用厚膜丝网印刷技术,电阻膜层稳定性优于碳膜电阻,成本低于薄膜电阻,兼顾性能与性价比;膜层耐老化性强,长期工作阻值漂移小。

2. 宽温环境下的可靠性

在-55~155℃范围内,阻值漂移可控(±100ppm/℃),适合高温工业设备、车载辅助电路等场景,无需额外散热设计。

3. 品牌质量保障

RALEC旺诠作为专业电阻制造商,产品通过RoHS 2.0、REACH SVHC环保认证,且通过IEC 61000系列环境测试(如温度循环、湿热测试),负载寿命测试(1000小时@70℃,阻值变化≤±1%)。

四、典型应用场景

1. 工业控制电路

  • PLC、变频器的信号分压/偏置电路:耐温特性适配工业现场(如车间高温、户外低温);
  • 传感器接口电路:作为温度/压力传感器的信号调理电阻。

2. 消费电子

  • 智能手机、平板的电源滤波/音频调理电路:1206封装满足小型化贴装需求;
  • 智能家居设备:如智能插座的过流保护电阻。

3. 汽车电子

  • 车载中控、仪表盘的辅助电路:宽温范围适配车载环境(-40~125℃常见);
  • 传感器分压电路:如胎压监测系统的信号转换。

4. 电源模块

  • DC-DC转换器的反馈分压电阻:250mW功率满足小功率电源需求;
  • 线性电源的输出滤波电阻。

五、选型与使用注意事项

1. 功率降额要求

持续工作场景下,实际功率需低于额定功率的80%(如250mW×80%=200mW),高温环境(>100℃)需进一步降额(如125℃时降为150mW)。

2. 电压限制

工作电压不得超过150V,避免击穿损坏;若需更高电压,需选择耐压更高的系列(如1/2W封装电阻)。

3. 精度匹配

若需高精度场景(如计量电路、高精度分压),需更换为±1%或±0.1%精度的薄膜电阻。

4. 封装适配

1206封装适合常规PCB设计,若需更小封装(如0805)或更大功率(如1W),需换型旺诠其他系列(如RTT0805或RTT1206)。

六、总结

RTT06104JTP作为旺诠的常规厚膜贴片电阻,以稳定的电气性能、宽温适应性及高性价比,成为工业控制、消费电子、汽车电子等领域的常用选型,满足大多数非高精度、小功率电路的需求,是中小批量生产的可靠选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.