WMSIC Electronic Components

RALEC RTT06R01JTP

ModelRTT06R01JTP
Package1206
BrandRALEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RALEC RTT06R01JTP
Type
RALEC
Minimum package
5000 圆盘

Technical parameters

Power
333mW
Electronic Component
Electronic Component
Electronic Component
RALEC
Electronic Component
RTT06R01JTP
Electronic Component
1
Package
1206
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.03g
Electronic Component
10mΩ
Electronic Component
1
Electronic Component
BM0265577699
Operating Temperature
55℃~+155℃
Operating Voltage
150V
Electronic Component
±1500ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RALEC RTT06R01JTP 贴片超低阻值厚膜电阻产品概述

一、产品基本信息
RTT06R01JTP是台湾旺诠(RALEC)推出的1206封装贴片超低阻值厚膜电阻,属于该品牌针对低阻值电流检测场景开发的系列产品。采用厚膜工艺制造,兼顾成本控制与基本稳定性,适配自动化贴装生产,广泛应用于电源、工业控制等领域的电流采样环节。

二、核心技术参数
该电阻的关键参数均符合工业级应用标准,具体如下:

  • 阻值:10mΩ(标称值0.01Ω),典型超低阻值设计;
  • 精度:±5%(行业标识“J”档),满足一般电流检测的精度需求;
  • 功率额定值:333mW(等效1/4W,实际标称更贴近真实功率能力);
  • 工作电压:150V,支持高压场景下的低阻值应用;
  • 温度系数(TCR):±1500ppm/℃,反映温度变化对阻值的影响程度;
  • 工作温度范围:-55℃至+155℃,覆盖工业级环境温度要求;
  • 封装尺寸:1206(英制,对应公制3.2mm×1.6mm),适配常规贴片生产线。

三、关键特性分析

  1. 超低阻值适配电流检测
    10mΩ的低阻值设计,可在电流流过时产生微小压降(如5A电流时压降仅50mV),既减少电路功率损耗,又便于通过运放放大采样电压实现电流监测,是电流检测电路的核心元件之一。

  2. 厚膜工艺的成本与性能平衡
    厚膜电阻通过丝网印刷、烧结等工艺制造,相比金属膜、合金电阻成本更低,且在-55~+155℃宽温范围内能保持基本阻值稳定性,适合对成本敏感但性能要求适中的场景。

  3. 功率与电压的匹配性
    333mW额定功率下,结合10mΩ阻值计算,最大允许电流约5.77A((I=\sqrt{P/R}=\sqrt{0.333/0.01}));150V工作电压确保高压电源、驱动电路中不会因电压击穿失效,覆盖更多应用场景。

  4. 宽温范围的环境适应性
    -55℃至+155℃的工作温度,满足工业设备(变频器、PLC)、部分汽车电子等 harsh 环境需求,无需额外温度补偿即可稳定工作。

  5. 1206封装的生产兼容性
    1206是贴片电阻主流封装,适配绝大多数自动化贴装设备,生产效率高,且可与同封装元件兼容布局,降低PCB设计难度。

四、典型应用场景
RTT06R01JTP的低阻值特性使其主要应用于电流检测相关领域:

  1. 电源模块电流采样:开关电源、线性电源的输出电流监测,实现过流保护与功率调节;
  2. 电机驱动电路:伺服电机、步进电机的电流反馈,优化电机控制精度;
  3. 电池管理系统(BMS):锂电池组充放电电流监测,保障电池安全;
  4. 工业控制设备:PLC、变频器、机器人控制器中的电流检测环节;
  5. 消费电子:手机充电器、移动电源的电流监测,提升充电效率与安全性。

五、使用注意事项

  1. 功率降额使用:高温环境(如>125℃)下,需参考旺诠官方降额曲线降低实际功率,避免电阻过热失效;
  2. 焊接温度控制:回流焊峰值温度不超过260℃、时间不超过10秒,防止厚膜层损伤;
  3. 精度与温度系数考量:若需±1%高精度检测,需更换RTT06R01FTP(F档);若对温度敏感,可搭配补偿电路或选低TCR合金电阻;
  4. 静电防护:焊接与存储过程中需注意静电防护,避免损坏元件。

六、选型参考
若需扩展应用,可参考旺诠同系列型号:

  • 更高精度:RTT06R01FTP(±1%精度);
  • 更高功率:RTT10R01JTP(2010封装,1W功率);
  • 更低温度系数:选择RALEC RN系列合金电阻(TCR≤±100ppm/℃),但成本更高。

该产品凭借低成本、宽温、适配贴装的优势,成为低阻值电流检测场景的高性价比选择,广泛应用于中低端电源与工业控制领域。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.