Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品名称: RTT05563JTP
品牌: RALEC(旺诠)
封装: 0805
类型: 贴片电阻
电阻类型: 厚膜电阻
阻值: 56kΩ
精度: ±5%
功率: 125mW
最大工作电压: 150V
工作温度范围: -55℃ ~ +155℃
温度系数: ±100ppm/℃
RTT05563JTP 是 RALEC(旺诠)推出的一款高性能贴片电阻,采用0805封装,广泛应用于各种电子设备中。该电阻具有56kΩ的阻值,精度为±5%,功率为125mW,能够在-55℃至+155℃的宽温度范围内稳定工作。其厚膜电阻技术确保了产品的高可靠性和耐久性,适用于多种复杂的电路环境。
高精度与稳定性
RTT05563JTP 的精度为±5%,能够满足大多数电路设计的需求。其厚膜电阻技术提供了优异的电气性能和长期稳定性,确保在复杂的工作环境中仍能保持一致的阻值。
宽工作温度范围
该电阻的工作温度范围为-55℃至+155℃,适用于极端温度环境下的应用,如工业设备、汽车电子和航空航天等领域。
低温度系数
温度系数为±100ppm/℃,表明该电阻在不同温度下的阻值变化较小,适合对温度敏感的高精度电路设计。
高功率密度
尽管封装尺寸为0805,RTT05563JTP 的功率高达125mW,能够在紧凑的空间内提供较高的功率处理能力,适合高密度电路板设计。
优异的耐压性能
最大工作电压为150V,能够承受较高的电压冲击,适用于高压电路环境。
环保与可靠性
该产品符合RoHS等环保标准,采用优质材料和先进工艺制造,确保了产品的高可靠性和长寿命。
RTT05563JTP 贴片电阻广泛应用于以下领域:
| 参数名称 | 参数值 |
|---|---|
| 阻值 | 56kΩ |
| 精度 | ±5% |
| 功率 | 125mW |
| 最大工作电压 | 150V |
| 工作温度范围 | -55℃ ~ +155℃ |
| 温度系数 | ±100ppm/℃ |
| 封装 | 0805 |
| 电阻类型 | 厚膜电阻 |
| 品牌 | RALEC(旺诠) |
RTT05563JTP 是一款高性能、高可靠性的贴片电阻,适用于多种电子设备中的电路设计。其优异的电气性能、宽工作温度范围和高功率密度使其成为工业、汽车、通信和消费电子等领域的理想选择。RALEC(旺诠)作为知名品牌,确保了产品的高品质和稳定性,为用户提供了值得信赖的解决方案。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products