Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
RALEC RTT02473JTH
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- RALEC RTT02473JTH
- Type
- RALEC
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 62.5mW
- Electronic Component
- Electronic Component
- Electronic Component
- RALEC
- Electronic Component
- RTT02473JTH
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±5%
- Electronic Component
- 0.009g
- Electronic Component
- 47kΩ
- Electronic Component
- 50
- Electronic Component
- BM0265147802
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 50V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RTT02473JTH 产品概述
1. 产品简介
RTT02473JTH 是一款由 RALEC（旺诠）生产的贴片电阻，属于厚膜电阻系列。该电阻具有 47kΩ 的阻值，精度为 ±5%，功率为 62.5mW，封装形式为 0402。其设计适用于广泛的工作温度范围，从 -55℃ 到 +155℃，并且最大工作电压为 50V。RTT02473JTH 的温度系数为 ±100ppm/℃，确保了在不同温度环境下的稳定性能。
2. 技术规格
- 阻值: 47kΩ
- 精度: ±5%
- 功率: 62.5mW
- 工作温度范围: -55℃ ~ +155℃
- 最大工作电压: 50V
- 温度系数: ±100ppm/℃
- 电阻类型: 厚膜电阻
- 封装: 0402
3. 产品特点
- 高精度: 提供 ±5% 的精度，确保电路设计的可靠性。
- 宽工作温度范围: 能够在 -55℃ 到 +155℃ 的温度范围内稳定工作，适用于各种环境。
- 低温度系数: ±100ppm/℃ 的温度系数，保证了在不同温度下的电阻值稳定性。
- 小封装: 0402 封装尺寸，适合高密度 PCB 设计，节省空间。
- 厚膜技术: 采用厚膜电阻技术，提供良好的电气性能和耐久性。
4. 应用领域
RTT02473JTH 贴片电阻广泛应用于各种电子设备中，包括但不限于：
- 消费电子: 如智能手机、平板电脑、笔记本电脑等。
- 工业控制: 如 PLC、传感器、自动化设备等。
- 通信设备: 如路由器、交换机、基站等。
- 汽车电子: 如车载娱乐系统、导航系统、传感器等。
- 医疗设备: 如监护仪、诊断设备、治疗设备等。
5. 优势与价值
- 可靠性: 通过严格的质量控制和测试，确保产品的高可靠性和长寿命。
- 性价比: 在保证高性能的同时，提供具有竞争力的价格。
- 环保: 符合 RoHS 等环保标准，减少对环境的影响。
- 技术支持: RALEC 提供全面的技术支持和售后服务，帮助客户解决应用中的问题。
6. 使用建议
- PCB 设计: 在设计 PCB 时，应考虑到 0402 封装的尺寸和布局，确保焊接质量和电气连接。
- 焊接工艺: 建议使用回流焊工艺，确保焊接的可靠性和一致性。
- 温度管理: 在高温环境下使用时，应注意散热设计，避免电阻过热影响性能。
7. 结论
RTT02473JTH 贴片电阻凭借其高精度、宽工作温度范围、低温度系数和小封装等优点，成为各种电子设备中的理想选择。无论是消费电子、工业控制还是汽车电子，RTT02473JTH 都能提供稳定可靠的性能，满足不同应用场景的需求。RALEC 作为知名品牌，其产品质量和技术支持也为用户提供了额外的保障。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
