Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
RALEC RTT031502BTP
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- RALEC RTT031502BTP
- Type
- RALEC
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 100mW
- Electronic Component
- Electronic Component
- Electronic Component
- RALEC
- Electronic Component
- RTT031502BTP
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- SMD Resistor
- Electronic Component
- ±0.1%
- Electronic Component
- 0.023g
- Electronic Component
- 15kΩ
- Electronic Component
- 1
- Electronic Component
- BM0265577706
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 75V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RTT031502BTP 产品概述
1. 产品简介
RTT031502BTP 是一款由 RALEC（旺诠）公司生产的高精度贴片电阻，属于厚膜电阻系列。该电阻具有 15kΩ 的阻值，精度高达 ±0.1%，适用于各种高精度电子电路设计。其封装形式为 0603，尺寸小巧，便于在紧凑的 PCB 布局中使用。
2. 主要参数
- 功率: 100mW
- 阻值: 15kΩ
- 精度: ±0.1%
- 电阻类型: 厚膜电阻
- 工作温度范围: -55℃ ~ +155℃
- 最大工作电压: 75V
- 温度系数: ±100ppm/℃
- 封装: 0603
3. 产品特点
- 高精度: 精度为 ±0.1%，适用于需要高精度电阻的电路设计，如精密测量仪器、传感器接口等。
- 宽工作温度范围: 工作温度范围为 -55℃ ~ +155℃，能够在极端环境下稳定工作，适用于工业、汽车等严苛环境。
- 低温度系数: 温度系数为 ±100ppm/℃，在温度变化时阻值变化小，保证了电路的稳定性。
- 厚膜技术: 采用厚膜电阻技术，具有较高的可靠性和稳定性，适用于长期使用的电子设备。
- 小封装: 0603 封装尺寸小巧，适合高密度 PCB 布局，节省空间。
4. 应用领域
RTT031502BTP 广泛应用于各种电子设备和系统中，包括但不限于：
- 消费电子: 如智能手机、平板电脑、笔记本电脑等，用于信号处理、电源管理等电路。
- 工业控制: 如 PLC、工业传感器、自动化设备等，用于精密测量和控制电路。
- 汽车电子: 如发动机控制单元、车载娱乐系统、车身控制模块等，用于高可靠性和高稳定性的电路设计。
- 医疗设备: 如医疗监测仪器、诊断设备等，用于高精度和高稳定性的电路设计。
- 通信设备: 如基站、路由器、交换机等，用于信号处理和电源管理电路。
5. 技术优势
- 高可靠性: 采用优质材料和先进工艺，确保产品在长期使用中的高可靠性。
- 环保合规: 符合 RoHS 等环保标准，适用于全球市场。
- 易于焊接: 0603 封装设计便于自动化焊接，提高生产效率。
6. 使用注意事项
- 焊接温度: 建议使用适当的焊接温度和时间，避免过热导致电阻损坏。
- 存储条件: 应存放在干燥、无尘的环境中，避免潮湿和污染。
- 电气参数: 在设计电路时，应确保电阻的功率、电压等参数符合实际应用需求，避免过载。
7. 结论
RTT031502BTP 是一款高性能、高精度的贴片电阻，适用于各种高精度和高可靠性的电子电路设计。其宽工作温度范围、低温度系数和小封装尺寸使其在多个领域具有广泛的应用前景。RALEC（旺诠）作为知名的电子元器件制造商，其产品质量和可靠性得到了市场的广泛认可。选择 RTT031502BTP，将为您的电子设计提供稳定、可靠的解决方案。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
