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RALEC RTT061000FTP
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- RALEC RTT061000FTP
- Type
- RALEC
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 250mW
- Electronic Component
- Electronic Component
- Electronic Component
- RALEC
- Electronic Component
- RTT061000FTP
- Electronic Component
- 1
- Package
- 1206
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.03g
- Electronic Component
- 100Ω
- Electronic Component
- 1
- Electronic Component
- BM0265147686
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 150V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RTT061000FTP 厚膜贴片电阻产品概述
一、产品基本定位与核心属性
RTT061000FTP是台湾旺诠（RALEC）推出的1206封装厚膜贴片电阻，定位于中低功率、常规精度的电路设计需求，适配消费电子、工业控制、汽车辅助电路等多领域的常规应用场景。作为厚膜电阻系列的典型产品，其兼顾成本优势与性能稳定性，是批量生产中常用的基础阻性元件。
二、核心性能参数详解
该电阻的关键参数可满足大多数常规电路的设计要求，具体如下：
- 阻值与精度：标称阻值100Ω，精度±1%——此精度等级覆盖多数信号调理、分压电路的偏差需求，无需额外校准即可实现基本功能；
- 功率与电压：额定功率250mW，最大工作电压150V——功率适配中小功率负载（如LED驱动、信号放大限流），150V电压上限支持部分中压电路（如小型电源模块滤波、分压）；
- 温度特性：温度系数±100ppm/℃，工作温度范围-55℃~+155℃——温度系数表示每摄氏度阻值相对变化率（±100ppm即温度升1℃，阻值变化±0.01%），宽温范围可在极端环境下保持稳定；
- 工艺类型：厚膜工艺——通过丝网印刷电阻浆料、高温烧结成型，相比薄膜电阻成本更低，相比线绕电阻体积更小，适合贴片自动化生产。
三、封装与结构特点
RTT061000FTP采用1206英制封装（公制3216，尺寸3.2mm×1.6mm），属于表面贴装（SMD）元件，具备以下优势：
- 贴装兼容性：适配回流焊、波峰焊等自动化工艺，适合大规模批量生产，降低人工成本；
- 体积优势：小巧封装可在高密度PCB设计中节省空间，满足智能手机、智能穿戴等小型化产品布局需求；
- 结构稳定性：厚膜电阻层与陶瓷基底结合紧密，抗机械应力、抗潮湿性能优于部分薄膜电阻，长期使用阻值漂移小。
四、典型应用场景
基于性能与封装特点，该电阻可广泛应用于：
- 消费电子：智能手机/平板的电源管理模块（电池充放电限流、分压）、音频电路信号衰减；
- 工业控制：PLC输入输出接口、传感器信号调理（如温度传感器分压校准）；
- 汽车辅助电路：车载中控屏小功率电源、倒车雷达信号匹配（宽温适配车载环境）；
- 通信设备：小型基站/路由器的射频匹配、电源滤波阻容网络。
五、可靠性与选型价值
- 可靠性验证：通过旺诠工业级测试（高温存储、温度循环、湿度测试），-55℃~+155℃环境下稳定工作超1000小时；
- 性价比优势：厚膜工艺降本，1206封装为市场主流，库存充足，适合中低端产品批量选型；
- 兼容性：引脚布局、贴装参数与同类1206封装电阻一致，可直接替换竞品，降低设计变更成本。
六、使用注意事项
- 实际功率需低于250mW，避免过载导致阻值漂移或烧毁；
- 贴装遵循1206封装回流焊温度曲线，避免高温损坏电阻层；
- 存储环境湿度≤60%，避免长期潮湿影响性能。
该产品以平衡的性能与成本优势，成为常规电路设计中高性价比的阻性元件选择。
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