Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
RALEC LR2728-24R005F1 LR2728
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- RALEC LR2728-24R005F1
- Type
- RALEC
- Minimum package
- 1000 圆盘
Technical parameters
- Power
- 4W
- Electronic Component
- Electronic Component
- Electronic Component
- RALEC
- Electronic Component
- LR2728-24R005F1
- Electronic Component
- 1
- Package
- 2728
- Electronic Component
- Current Sense Resistor / Shunt
- Electronic Component
- ±1%
- Electronic Component
- 0.301g
- Electronic Component
- 5mΩ
- Electronic Component
- 1
- Electronic Component
- BM0265114427
- Electronic Component
- SMD
- Electronic Component
- ±25ppm/℃
- Resistor Type
- Resistor
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LR2728-24R005F1 产品概述
一、产品简介
LR2728-24R005F1 是 RALEC（旺诠）推出的一款高性能贴片合金电流采样电阻（分流器），标准阻值 5 mΩ，精度 ±1%，额定功率 4 W，温度系数 ±25 ppm/℃，2728 紧凑贴片封装。适用于对电流测量精度和热稳定性有较高要求的电源管理和电池管理系统等场景。
二、主要性能特点
- 低阻值：5 mΩ，适合大电流采样，压降小，功率损耗可控。
- 高精度：±1% 出厂配比，满足一般控制与测量应用精度要求。
- 低温漂：±25 ppm/℃，在宽温度范围内保持阻值稳定，利于长时间精密测量。
- 高功率密度：4 W 额定功率（贴片），在紧凑空间内仍能承受较大电流。
- 贴片封装：2728 型号，便于自动化贴装和批量生产。
三、电气与热性能要点
- 功率与电流关系：P = I^2·R。以 5 mΩ、4 W 为例，允许的理想连续电流约为 28.3 A（sqrt(4/0.005) ≈ 28.3A）。
- 常见工况示例：10 A 时压降 50 mV，功耗 0.5 W；20 A 时压降 100 mV，功耗 2 W；25 A 时压降 125 mV，功耗 3.125 W。
- 温升与散热：贴片电阻的实际允许电流受 PCB 散热能力影响显著，推荐通过增加铜箔面积、热铜平面和过孔改善散热并按环境温度进行功率换算与降额设计。
四、典型应用场景
- 电池管理系统（BMS）与充放电电流监控
- 开关电源和 DC-DC 转换器的电流检测与过流保护
- 电机驱动与伺服控制的实时电流采样
- 充电桩、车载电源与逆变器的电流测量模块
- 精密测试和数据采集系统中的低阻抗测量
五、安装与使用建议
- PCB 布局建议：为降低温升和提高测量精度，分流器两端应使用粗短主流铜迹传导大电流，必要时采用 Kelvin（四端）测量法分离电压采样回路。
- 散热处理：在分流器下方和两侧布置较大铜面积并添加通孔连通多层铜平面以提升散热能力。
- 焊接工艺：支持回流焊工艺，遵循厂家推荐的回流曲线以避免过热造成参数漂移或焊点缺陷。
- 可靠性注意：长期高温工况下应按温度-功率曲线进行降额使用，避免长期满载运行导致阻值漂移或寿命缩短。
六、选型与注意事项
- 若系统需更高精度或受引线影响较大，考虑采用四端分流器或在 PCB 上实现 Kelvin 采样。
- 高侧测量时需注意放大器的共模电压范围与耐压能力；低侧测量虽电路简单但可能影响参考地噪声。
- 最终选型时，除阻值与功率外应综合考虑封装尺寸、散热条件、环境温度范围与可靠性要求，必要时与供应商确认样片测试数据。
LR2728-24R005F1 以其低阻值、低温漂与较高功率密度，适合在体积受限但需可靠大电流采样的场合使用。选择与布局合理可显著提升测量精度与系统稳定性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
