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RALEC RTT021002FTH
Configuration
1 options
Configuration
Option 159780
Availability on request
Technical data
Product details
19
specifications
Core information
- Product name
- RALEC RTT021002FTH
- Type
- RALEC
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 62.5mW
- Electronic Component
- Electronic Component
- Electronic Component
- RALEC
- Electronic Component
- RTT021002FTH
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.009g
- Electronic Component
- 10kΩ
- Electronic Component
- 10
- Electronic Component
- BM0259730919
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 50V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RTT021002FTH 产品概述
一、产品简介
RTT021002FTH 是 RALEC（旺诠）推出的一款0402封装厚膜贴片电阻，阻值 10 kΩ，精度 ±1%，额定功率 1/16W（62.5 mW）。该器件针对空间有限、要求中等精度及稳定性的表面贴装应用，兼顾体积最小化和良好的机械强度，适合大批量 SMT 生产线使用。
二、主要参数
- 电阻类型：厚膜电阻
- 阻值：10 kΩ
- 精度：±1%
- 额定功率：62.5 mW（室温）/ 1/16W
- 最大工作电压：50 V
- 温度系数（TCR）：±100 ppm/℃
- 工作温度范围：-55 ℃ ~ +155 ℃
- 封装：0402（片式 SMD）
- 品牌：RALEC（旺诠）
- 型号：RTT021002FTH
三、主要特性与优势
- 小型化封装（0402）占板面积小，适合高密度布板与便携式设备。
- ±1% 精度满足多数模拟电路和分压/偏置网络的稳定性需求。
- ±100 ppm/℃ 的温度系数在普通温度变化场合下表现良好，适用于中等精度的温度环境。
- 宽工作温度范围（-55 ℃ 至 +155 ℃），适应工业级环境。
- 厚膜工艺成本可控，批量一致性好，适合商业和工业类产品的大规模生产。
四、典型应用场景
- 便携式终端、手持设备、可穿戴设备功率与信号分压网络。
- 物联网（IoT）节点、传感器模块的偏置与采样电路。
- 消费类电子、家电控制板中的通用电阻网络。
- 工业控制与仪表中对空间、温度适应性有要求的场合。
五、使用与焊接建议
- 回流焊工艺：建议采用常规无铅回流焊工艺，遵循 PCB 与焊料供应商的回流曲线；通常峰值温度 ≤ 260 ℃（以实际工艺规范为准）。
- 焊盘设计：按 0402 标准焊盘布局，控制焊膏用量，避免焊桥与 tombstoning。
- 功率与降额：62.5 mW 为室温额定功率；在高温工况下应按厂商提供的降额曲线或热设计规范进行降载使用，确保长期可靠性。
- 静电与机械：器件为被动元件，日常搬运注意防止过力挤压或弯曲，贴片贴装时避免强烈振动与冲击。
六、存储与可靠性
- 包装通常为卷带盘装（请以实际采购包装为准），开盘后建议尽快使用以减少受潮风险。
- 存储条件建议保持干燥、避免长期高温高湿环境；如长期储存或多次回流，按供应商建议执行烘箱预处理或吸湿性评估。
- 可靠性指标（如寿命、焊后耐热、耐湿热等）应参照 RALEC 的正式技术资料或样品验证数据进行设计验证。
七、选型与采购建议
选择 RTT021002FTH 时请确认阻值、精度与功率满足电路设计需求。批量导入前建议做样品验证，包括温漂、功耗降额、回流可靠性和长期老化测试。如需更高精度或更低 TCR，可考虑薄膜或高精度系列器件；如需更高功率或更大封装，请选用相应更大封装型号。
如需完整的技术规格书、降额曲线或可靠性测试数据，请联系 RALEC（旺诠）或其授权分销商获取正式资料。
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