Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
RALEC RTT021622FTH
Configuration
1 options
Configuration
Option 159783
Availability on request
Technical data
Product details
19
specifications
Core information
- Product name
- RALEC RTT021622FTH
- Type
- RALEC
- Minimum package
- 10000
Technical parameters
- Power
- 62.5mW
- Electronic Component
- RALEC
- Electronic Component
- RTT021622FTH
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.009g
- Electronic Component
- 16.2kΩ
- Electronic Component
- 10
- Electronic Component
- BM0265975624
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 50V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RTT021622FTH 产品概述
1. 产品简介
RTT021622FTH 是一款由 RALEC（旺诠）公司生产的贴片电阻，属于厚膜电阻系列。该电阻采用 0402 封装，具有高精度和稳定的性能，适用于各种电子电路中的电流限制、分压和信号调节等应用。
2. 关键参数
- 功率: 62.5mW (1/16W)
- 阻值: 16.2kΩ
- 精度: ±1%
- 温度系数: ±100ppm/℃
- 最大工作电压: 50V
- 工作温度范围: -55℃ ~ +155℃
- 电阻类型: 厚膜电阻
- 封装: 0402
3. 产品特点
- 高精度: 该电阻的精度为 ±1%，确保了电路中的精确阻值，适用于对精度要求较高的应用场景。
- 宽工作温度范围: 能够在 -55℃ 到 +155℃ 的温度范围内稳定工作，适应各种环境条件。
- 低温度系数: 温度系数为 ±100ppm/℃，在温度变化时阻值变化较小，保证了电路的稳定性。
- 小封装: 采用 0402 封装，体积小巧，适合高密度 PCB 布局，节省空间。
- 厚膜技术: 采用厚膜电阻技术，具有较高的可靠性和耐久性，适用于长期稳定工作的电路。
4. 应用领域
RTT021622FTH 贴片电阻广泛应用于以下领域：
- 消费电子: 如智能手机、平板电脑、笔记本电脑等设备中的电路板。
- 通信设备: 用于基站、路由器、交换机等通信设备中的信号处理和电源管理电路。
- 工业控制: 在工业自动化设备中用于电流检测、信号调节和分压电路。
- 汽车电子: 适用于汽车电子系统中的传感器、控制模块和电源管理电路。
- 医疗设备: 在医疗仪器中用于精确的电流控制和信号处理。
5. 技术优势
- 高可靠性: 采用优质材料和先进制造工艺，确保产品在恶劣环境下仍能稳定工作。
- 环保合规: 符合 RoHS 等环保标准，满足全球市场的环保要求。
- 易于焊接: 适合自动化贴片焊接工艺，提高生产效率。
6. 使用建议
- 电路设计: 在设计电路时，应考虑电阻的功率、阻值和精度，确保其满足电路需求。
- 焊接工艺: 采用适当的焊接工艺，避免过热或过冷，确保电阻的可靠连接。
- 温度管理: 在高温环境下使用时，应注意散热，避免电阻过热影响性能。
7. 品牌与质量保证
RALEC（旺诠）作为知名的电子元器件制造商，以其高质量和可靠性著称。RTT021622FTH 贴片电阻经过严格的质量控制和测试，确保每一颗电阻都符合高标准的质量要求。
8. 总结
RTT021622FTH 贴片电阻凭借其高精度、宽工作温度范围和小封装等优势，成为各种电子电路中的理想选择。无论是在消费电子、通信设备还是工业控制领域，该电阻都能提供稳定可靠的性能，满足多样化的应用需求。选择 RALEC（旺诠）的 RTT021622FTH 贴片电阻，将为您的电路设计带来更高的可靠性和性能保障。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
