WMSIC Electronic Components

RENESAS AT25PE20-SSHN-T AT25PE20

ModelAT25PE20-SSHN-T
PackageSOIC-8
BrandRENESAS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 22+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RENESAS AT25PE20-SSHN-T
Type
RENESAS
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RENESAS
Electronic Component
AT25PE20-SSHN-T
Electronic Component
1
Package
SOIC-8
Electronic Component
NOR FLASH
Electronic Component
0.15g
Electronic Component
1
Features
positions
Electronic Component
BM0265113794
Electronic Component
2Mbit
Operating Voltage
1.65V~3.6V
Current
25uA
Interface Type
SPI
Electronic Component
100000
Clock Frequency(fc)
85MHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AT25PE20-SSHN-T 产品概述

一、产品简介

AT25PE20-SSHN-T 是瑞萨(RENESAS)推出的一款容量为 2 Mbit 的 SPI 串行闪存存储器,封装为常用的 8 引脚 SOIC。器件支持最高 85 MHz 的 SPI 时钟频率,工作电压范围宽(1.65V~3.6V),并集成上电复位及多重写保护机制,适合对容量、功耗和可靠性有平衡要求的嵌入式系统和工业控制应用。

二、主要规格亮点

  • 存储容量:2 Mbit(256 KB)
  • 接口类型:标准 SPI(高达 85 MHz)
  • 工作电压:1.65 V 至 3.6 V,兼容单节锂电池和 3.3 V 系统
  • 待机电流:典型 25 μA(低功耗待机,利于电池应用)
  • 写入性能:页写时间 Tpp ≈ 3 ms
  • 擦写寿命:擦写次数 ≥ 100,000 次
  • 数据保持:TDR ≥ 20 年
  • 包装:SOIC-8(8 引脚小外形封装)

三、功能特性

  • 硬件写保护与软件写保护并存,可通过外部写保护引脚与状态寄存器位实现灵活的防写入策略;
  • 上电复位功能确保在电源异常或上电瞬时数据总线处于确定状态,降低系统初始化风险;
  • 标准 SPI 协议兼容性良好,便于与 MCU、FPGA 等主控器件连接和集成。

四、典型应用场景

适用于固件存储、引导程序(Bootloader)、配置数据、校准参数和小容量数据记录等场景。常见行业包括物联网终端、便携式医疗设备、工业控制器、消费类电子和汽车电子(参考温度与可靠性要求)。

五、设计与使用建议

  • 电源与地应靠近 VCC/GND 引脚放置去耦电容(0.1 μF),抑制纹波和瞬态;
  • 高速 SPI(接近 85 MHz)时注意走线差分长度与终端匹配,必要时在 MOSI/MISO/SCLK 上添加小阻抗以抑制振铃;
  • 使用硬件 WP 与软件保护组合,保障关键代码区在正常运行和固件升级期间的安全;
  • 由于擦写寿命为 100k 次,针对频繁写入场景建议采用写放大控制或环形写入策略以延长使用寿命。

六、可靠性与选型要点

器件数据保持能力可达 20 年,适合长期部署的产品。选择时关注工作温度范围与实际应用环境、封装焊接工艺(SOIC-8 的再流温度限制)以及供应链与生命周期管理,确保长期可得性。

七、封装与采购

AT25PE20-SSHN-T 提供 SOIC-8 封装,便于在常见 PCB 布局中替换和调试。采购时请确认批号、供货包装与完整的数据手册,以便获取完整引脚定义、指令集和电气规范。

如需进一步的时序图、指令详解或参考电路设计(包括 PCB 布局示意与上电复位建议),可提供更具体的工程资料以便给出针对性的支持。

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