WMSIC Electronic Components

RENESAS X5045S8IZT1

ModelX5045S8IZT1
PackageSOIC-8
BrandRENESAS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RENESAS X5045S8IZT1
Type
RENESAS
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RENESAS
Electronic Component
X5045S8IZT1
Electronic Component
1
Package
SOIC-8
Electronic Component
EEPROM
Electronic Component
0.348g
Electronic Component
1
Features
Built-in positions(POR);; Built-in Latch(WEL)
Electronic Component
BM0019123164
Electronic Component
4Kbit
Operating Temperature
40℃~+85℃
Operating Voltage
2.7V~5.5V
Interface Type
SPI
Electronic Component
100
Clock Frequency(fc)
3.3MHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:X5045S8IZT1

概述

X5045S8IZT1是一款先进的监控与复位芯片,采用表面贴装型(SMD)SOIC-8封装。该产品由瑞萨电子(RENESAS)出品,专为现代电子设备提供高性能的电压监控和复位功能。X5045S8IZT1的设计旨在满足广泛的应用需求,尤其是在需要电源电压监控及系统稳定运行的场景中非常有效。

关键特性

  • 监控电压阈值: 该芯片的电压阈值设置为4.38V,表明它能够有效监控工作电压的变化,并在电压降至阈值以下时激活复位功能。这一特性确保设备在电压异常时能够及时复位,保护系统及其他元器件的安全与稳定。
  • 复位功能: X5045S8IZT1支持简单复位和加电复位的功能,具有高电平有效的特性。在电源第一次接通或出现电压异常时,芯片会即时进行复位操作,确保系统可以顺利启动或重新进入稳定工作状态。
  • 超时特性: 复位超时功能设定为最低100ms,确保在发生复位时,系统能够在适当的时间内稳定下来、并恢复到预期的工作状态。这一设计避免了由于短时间的电压波动引起的频繁复位,维护了系统的可靠性和稳定性。
  • 工作温度范围: X5045S8IZT1能够在-40°C至85°C的广泛温度范围内稳定工作,使其在多种工业环境中具有良好的适应性。从严寒的北方地区到炎热的工业车间,该芯片均能保证其性能的可靠。

应用场景

X5045S8IZT1广泛应用于各类电子设备和系统的电源管理,包括但不限于:

  • 嵌入式系统:适用于微控制器和数字信号处理器等嵌入式应用,确保其电源电压在正常范围内,避免由于电源异常导致的系统崩溃。
  • 消费电子产品:可用于各类家用电器和消费电子产品中,如智能家居设备,确保其在复杂电源环境下的稳定运行。
  • 工业控制系统:在自动化设备及工业控制系统中,X5045S8IZT1提供电压监控,提升设备的安全性和可靠性。
  • 汽车电子:在现代汽车的电子控制单元(ECU)中,该芯片可以有效监控电源,确保汽车电子系统在各种驾驶条件下均能正常运行。

封装与安装

X5045S8IZT1采用SOIC-8封装,这种封装类型便于在PCB板上进行自动化贴装,节省空间并提高生产效率。同时,SOIC-8封装的引脚布局为工程师提供了更大的设计灵活性,使得与其他电子元件的集成更加简便。

总结

X5045S8IZT1是一个可靠的解决方案,通过对电压的监控和复位功能,确保电气系统在正常的工作条件下运行。凭借其高阈值设定和广泛的工作温度范围,这款监控复位芯片可以满足各种工业和消费电子应用的需求。在当今电子产品高度复杂和功能多样的环境中,X5045S8IZT1无疑将为设备提供必要的电源管理保障,保证产品的性能和安全性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.