WMSIC Electronic Components

RENESAS R5F102AAASP#10 R5F102AAASP

ModelR5F102AAASP#10
PackageLSSOP-30-6.1mm
BrandRENESAS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
RENESAS R5F102AAASP#10
Type
RENESAS
Unit
Electronic Component
Minimum package
1680 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
RENESAS
Electronic Component
R5F102AAASP#10
Electronic Component
1
Package
LSSOP-30-6.1mm
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
1.2g
CPU
16 Bit
CPU
RL78
I / O
23
RAM
2KB
Electronic Component
1
ADC
10bit
EEPROM
2KB
Electronic Component
BM0257410093

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

R5F102AAASP#10 产品概述

一、概述

R5F102AAASP#10 属于 Renesas RL78 系列 16 位低功耗单片机,针对成本与功耗敏感的嵌入式应用而设计。器件集成度高、外围资源合理,适合简单控制、传感器读取和电源管理等场景。内置振荡器可降低外部器件需求,加快开发周期。

二、主要规格

  • CPU 内核:RL78,16 bit
  • 最大主频:24 MHz
  • 程序存储:16 KB Flash
  • SRAM:2 KB
  • EEPROM:2 KB
  • I/O 引脚数:23 个
  • ADC:10 bit(通道视型号和封装而定)
  • 工作电压:1.8 V ~ 5.5 V
  • 工作温度:-40 ℃ ~ +85 ℃
  • 振荡器类型:内置
  • 封装:LSSOP-30(6.1 mm)

三、关键特性与优势

  • 低功耗:RL78 核心及电源管理机制在待机与运行模式下均能实现较低能耗,适合电池供电设备。
  • 丰富的片上资源:Flash/RAM/EEPROM 比例适合需要少量数据存储与固件更新的应用。
  • 内置振荡器:减少外部晶振需求,降低 BOM 成本并简化 PCB 布局。
  • 宽工作电压范围:1.8–5.5 V,提高系统兼容性,能直接驱动多数低压传感器与外围器件。
  • 工业级温度范围:-40~85 ℃,满足多数工业与车载周边应用环境要求。

四、典型应用

  • 家用与楼宇控制:电机控制、照明驱动、定时器与继电器控制。
  • 传感器节点:温湿度、光照等采集并通过上层通信模块上报。
  • 便携式与电池供电设备:低速数据采集、按键处理与电源管理。
  • 小型消费类电子与工业控制子模块。

五、封装与设计建议

  • 推荐 LSSOP-30 封装在空间受限但需要更多 I/O 情况下使用,留意散热与焊盘设计。
  • 若对精确时钟要求较高,建议外接晶振以提高定时精度。
  • 电源滤波与稳压设计应保证在 1.8–5.5 V 范围内稳定工作;关键模拟信号线应靠近地平面布局以降低噪声影响。

R5F102AAASP#10 以其均衡的性能、低功耗与成本优势,适用于对资源需求适中、需长期稳定运行的小型嵌入式系统。若需更详细的引脚分配、外设时序或开发支持信息,可参考 Renesas 官方数据手册与参考设计。

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