Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
RENESAS ISL1208IU8Z-TK ISL1208IU8Z
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- RENESAS ISL1208IU8Z-TK
- Type
- RENESAS
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- RENESAS
- Electronic Component
- ISL1208IU8Z-TK
- Electronic Component
- 1
- Package
- MSOP-8
- Electronic Component
- Real-Time Clock (RTC)
- Electronic Component
- 0.488g
- Electronic Component
- 1
- Features
- Power Management and Battery;; SRAM / NVRAM; Battery;; Programmable Clock Output
- Electronic Component
- BM0265138420
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 2.7V~5.5V
- Interface Type
- I2C
- Electronic Component
- Electronic Component
- Electronic Component
- 1000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ISL1208IU8Z-TK 产品概述
一、简介
ISL1208IU8Z-TK 是瑞萨（RENESAS）系列的实时时钟（RTC）芯片，采用两线 I²C 接口，工作电压范围 2.7V 至 5.5V，工作温度范围 -40℃ 至 +85℃，常见封装为 MSOP-8（亦等同于 8-TSSOP/MSOP-8 0.118" / 3.00mm 宽度）。该器件用于提供稳定的时钟与日历功能，适合在需断电维持时间的嵌入式与消费类电子设备中使用。
二、主要功能与特性
- 标准实时时钟/日历功能（秒、分、时、日、月、年，闰年处理等）。
- 通过 I²C（二线串口）进行寄存器读写与配置，便于单片机或主控访问。
- 宽电压工作范围 2.7V~5.5V，适配多种系统电源方案与电池备份。
- 工业级工作温度（-40℃~+85℃），可靠性高，适合户外与工业场景。
- 封装体积小，MSOP-8 有利于空间受限的 PCB 设计与批量生产。
三、典型应用场景
- 工业控制与数据记录设备需要精确时间戳。
- 通信设备与路由器的事件日志。
- 智能家居、可穿戴与便携设备的低功耗时间保持。
- 消费类电子（数码、音视频产品）的定时与闹钟功能。
四、电气与接口注意事项
- I²C 接口为两线制，SDA/SCL 需外接上拉电阻；上拉电阻阻值与总线容量、工作频率相关，典型值 4.7kΩ~10kΩ。
- 电源去耦：靠近 VCC 引脚放置 0.1µF 陶瓷电容，确保电源稳定。
- 备用电源/电池：若使用纽扣电池或超级电容备份，应设计合理的反向隔离与切换电路，避免主电源干扰。
- 晶振与时钟源：若芯片要求外部 32.768kHz 晶体或谐振器，布局应控制晶体走线与地回路，匹配负载电容并遵循厂家推荐的布线规范。
五、封装与 PCB 布局建议
- MSOP-8 外形小且引脚间距较细，焊盘设计应遵循瑞萨/封装制造商的推荐 land pattern，保证回流可靠性。
- 晶体、滤波电容与去耦电容应尽量靠近芯片相应引脚放置，避免长走线。
- 将 I²C 上拉电阻放置在靠近主控一侧并考虑总线长度与干扰抑制；必要时在总线上加串联阻尼（如几十欧姆）以改善信号完整性。
六、选型与采购提示
- 型号完整：ISL1208IU8Z-TK，确认封装为 MSOP-8 并与系统电压/温度范围匹配。
- 量产前建议获取器件数据手册（Datasheet）与评估板，核对寄存器映射、时钟精度、闹钟/中断特性及电源切换细节。
- 若对低功耗、闹钟精度或额外功能（如温度补偿、掉电检测）有特殊要求，可与瑞萨技术支持确认具体变体或替代型号。
如需，我可以根据您具体的系统电源方案、备份电池形式与 PCB 布局，给出更详尽的原理图与布局检查清单。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
