WMSIC Electronic Components

RENESAS ISL32495EIBZ-T ISL32495EIBZ

ModelISL32495EIBZ-T
PackageSOIC-8
BrandRENESAS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RENESAS ISL32495EIBZ-T
Type
RENESAS
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RENESAS
Electronic Component
ISL32495EIBZ-T
Electronic Component
1
Package
SOIC-8
Type
Transceiver
Electronic Component
RS-485 / RS-422IC
Electronic Component
0.001g
Electronic Component
128
Electronic Component
1
Features
Tx / Rx;;;; Low Power
Electronic Component
BM0257491084
Operating Temperature
40℃~+85℃
Operating Voltage
4.5V~5.5V
Receiver
1
Data
1Mbps

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ISL32495EIBZ-T 产品概述

一、产品简介

ISL32495EIBZ-T 是 RENESAS(瑞萨)出品的一款单驱单收发器,支持 RS-422/RS-485 半双工通信,封装为 SOIC-8。器件工作电压范围为 4.5V 至 5.5V,面向工业现场总线和差分串行通信场景设计,兼顾抗干扰能力与低功耗特性,适用于多节点(最多可达 128 节点)网络拓扑。

二、主要规格要点

  • 类型:收发器(Transceiver),半双工通信
  • 驱动器/接收器:1 驱动器 / 1 接收器
  • 通信标准:RS-422 / RS-485(差分信号)
  • 工作电压:4.5V ~ 5.5V
  • 数据速率:最高 1 Mbps
  • 最大节点数:128 节点(总线共享)
  • 静电保护:ESD 保护高达 ±16.5 kV
  • 工作温度范围:-40℃ ~ +85℃
  • 静态电流:2.3 mA(典型或最大静态电流,参考具体 datasheet)
  • 封装:SOIC-8

三、功能特点与优势

  • 高可靠性:支持工业级工作温度,适应宽温环境下长期运行。
  • 强抗静电能力:ESD 保护达 ±16.5 kV,有助于提高系统在现场布线和连接操作中的鲁棒性。
  • 低功耗表现:静态电流约 2.3 mA,有利于降低系统待机能耗,尤其在分布式节点较多的网络中更显优势。
  • 兼容性好:同时支持 RS-422 与 RS-485,能兼容不同差分总线设备与协议栈。
  • 易于扩展:支持最多 128 个节点,适用于多点总线拓扑,如楼宇自动化、工业控制网络等。

四、典型应用场景

  • 工业现场总线(PLC 到多从站连接)
  • 楼宇自控与监控系统(BMS、安防、照明控制)
  • 仪器仪表与数据采集系统(多路传感器网络)
  • 串行通信转换器与网关设备
  • 电梯、能源管理等需要长距离、抗干扰通信的系统

五、设计注意事项

  • 差分对布线:A/B 差分信号应成对走线并保持恒定阻抗,尽量减少走线长度差与环路面积,以降低共模干扰。
  • 终端匹配与偏置:在总线两端加入匹配电阻(120Ω 或根据阻抗定),必要时使用偏置电阻保证空闲总线电平稳定,避免总线冲突。
  • 电源旁路:在 VCC 附近放置合适的去耦电容(如 0.1 μF 与 10 μF 组合),减少电源噪声对收发性能影响。
  • ESD 防护:尽管器件本身具有较高 ESD 能力,外部接口仍建议配合浪涌保护器件或共模抑制器件以提升系统可靠性。
  • 半双工控制:根据应用选用硬件 DE/RE 控制或软件协议管理,避免总线上同时驱动造成冲突。

六、封装与采购建议

ISL32495EIBZ-T 采用 SOIC-8 封装,便于常规贴片生产工艺装配。采购时请注意核对完整型号、批次与温度等级,并参考 RENESAS 官方数据手册获取详细引脚定义与电气特性,以确保在目标系统中达到预期性能。

七、总结

ISL32495EIBZ-T 是一款面向工业现场差分通信的可靠收发器,具备宽电压、宽温度、良好抗静电与低静态功耗等特点。对于需要稳定长距离差分通信和多节点扩展的系统(如楼宇、工业控制与仪表),该器件是一个实用且经济的选择。购买和设计时建议结合官方 datasheet 做进一步参数验证与 PCB 布局优化。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.