WMSIC Electronic Components

RENESAS AT45DB041E-SSHN-T AT45DB041E

ModelAT45DB041E-SSHN-T
PackageSOIC-8
BrandRENESAS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 22+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RENESAS AT45DB041E-SSHN-T
Type
RENESAS
Minimum package
4000 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RENESAS
Electronic Component
AT45DB041E-SSHN-T
Electronic Component
1
Package
SOIC-8
Electronic Component
NOR FLASH
Electronic Component
0.169g
Electronic Component
1
Features
positions
Electronic Component
BM0266018013
Electronic Component
4Mbit
Operating Voltage
1.65V~3.6V
Current
25uA
Interface Type
SPI
Electronic Component
100000
Clock Frequency(fc)
85MHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AT45DB041E-SSHN-T 串行NOR闪存产品概述

AT45DB041E-SSHN-T是瑞萨电子(RENESAS)推出的DataFlash系列串行NOR闪存芯片,专为低功耗、高可靠性的嵌入式存储场景设计,核心定位为中容量、高速SPI接口的存储解决方案,兼顾性能与成本优势。

一、核心规格与存储结构

该芯片总存储容量为4Mbit(512KB),采用“页+扇区”的分层存储结构:

  • 2048个独立页,每页容量为264Byte(其中256Byte为用户有效数据区,8Byte为可选ECC/状态校验区,可提升数据可靠性);
  • 支持灵活的擦除粒度,包括页擦除(256Byte)、扇区擦除(如512Byte/1KB等),避免大面积数据擦除导致的冗余操作,适配不同数据更新需求。

二、高速SPI通信性能

AT45DB041E-SSHN-T采用标准SPI串行接口,支持最高85MHz时钟频率,单SPI模式下数据传输速率可达10.625MB/s,满足中高速场景的固件加载、配置参数读写需求。同时兼容SPI的多线模式(若支持),可进一步提升传输速率,适配高性能MCU系统。

三、低功耗设计与供电兼容性

芯片的低功耗特性是核心优势之一:

  • 待机电流仅25μA,深度睡眠模式电流更低(<1μA),适合电池供电的便携式设备;
  • 工作电压范围为1.65V~3.6V,完全兼容主流嵌入式系统的3.3V、1.8V供电,无需额外电平转换电路,简化硬件设计。

四、可靠性与寿命表现

  1. 擦写寿命:支持100,000次擦写循环,满足大多数嵌入式产品的长期使用需求(如产品生命周期内100次以上固件升级);
  2. 数据保留:在-40℃至85℃的宽温度范围内,可实现20年数据保留(TDR),确保存储数据的长期可靠性;
  3. 写保护功能:内置硬件写保护引脚(WP),可防止意外擦写,保护关键配置数据与固件安全。

五、封装与典型应用

1. 封装形式

采用NSOIC-8(窄体SOIC-8) 封装,尺寸紧凑(约4.9mm×3.9mm),节省PCB空间,适合小型化产品设计(如智能穿戴、小型IoT终端)。

2. 典型应用场景

  • 消费电子:智能手环、手表的固件存储与传感器数据缓存;智能遥控器、小型家电的配置参数存储;
  • 物联网终端:低功耗IoT设备(温湿度传感器、智能门锁)的固件与OTA升级数据存储;
  • 工业控制:小型PLC、传感器节点的程序存储与数据日志记录;
  • 汽车辅助电子:车载小屏显示、蓝牙模块的固件存储(非车规级高可靠场景)。

六、易用性与兼容性

该芯片完全兼容标准SPI接口,可直接与瑞萨RA系列、STM32系列等主流MCU对接,无需特殊驱动开发;支持SPI状态寄存器读取,可实时监控擦写完成状态、设备状态,提升系统可靠性。

综上,AT45DB041E-SSHN-T凭借高容量、高速SPI、低功耗与高可靠性,成为嵌入式系统中固件存储、配置参数保存的理想选择,尤其适合小型化、电池供电的终端产品。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.