Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
RENESAS ISL80113IRAJZ-T ISL80113IRAJZ
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- RENESAS ISL80113IRAJZ-T
- Type
- DFN-10(3X3)
- Unit
- Electronic Component
- Minimum package
- 6000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- 140mV@(3A)
- Electronic Component
- RENESAS
- Electronic Component
- 38uVrms
- Electronic Component
- ISL80113IRAJZ-T
- Electronic Component
- 1
- Package
- DFN-10(3x3)
- Electronic Component
- Linear Regulator(LDO)
- Electronic Component
- 0.117g
- Electronic Component
- 1
- Features
- Built-in
- Electronic Component
- BM0257410090
- Operating Temperature
- 40℃~+125℃@(Tj)
- Operating Voltage
- 3.6V
- Output
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ISL80113IRAJZ-T 产品概述
一 主要性能特性
ISL80113IRAJZ-T 是瑞萨（Renesas）推出的一款高性能线性可调稳压器，单路输出、正极性，额定输出电流最高达3A。输出可调范围为500mV～3.3V，典型压差仅140mV@3A，适合靠近电池或低压开关后级的点对点稳压应用。器件静态电流(Iq)约8mA，噪声低至38uVrms，电源纹波抑制比(PSRR)在120Hz时可达80dB，能有效抑制开关电源带来的低频纹波。内置过流和过热保护，工作结温范围-40℃～+125℃，封装为DFN-10 (3x3)。
二 优势与典型应用
- 低压差与大电流的组合（140mV@3A）使其能在输入接近输出时仍提供稳定供电，延长电池使用时间或减少对后级开关电源的依赖。
- 高PSRR与低噪声特性适合用于高性能模拟电路、ADC/DAC、电台前端及精密传感器供电。
- 适用于通信设备、工业控制、消费类电子与电池供电系统等需要低噪声、稳定参考的点负载场景。
三 保护与可靠性
芯片集成过流保护（OCP）和过热保护（OTP），在超过设定限值或温度异常时自动限制输出或关断，提升系统可靠性。器件额定的工作结温上限为+125℃，适应较为严苛的工业环境。若用于关键应用，请参考制造商完整数据手册进行可靠性评估与寿命预测。
四 封装与热设计建议
DFN-10 (3x3) 小型封装利于高密度布局，但在3A高电流工况下需关注热量散逸。建议在PCB上配合大面积散热铜箔并使用多点热通孔（thermal vias）下穿到内层或底层散热层，以降低结温并维持稳定输出。器件引脚与大地焊盘的连接对热阻影响显著，推荐按照厂商评价板布局以获得最佳热性能。
五 设计要点与外部元件
ISL80113 为可调输出结构，通常通过外部电阻分压设置输出电压（内置参考约500mV），具体计算与引脚连接请参考数据手册。输入与输出端建议使用低ESR陶瓷电容以降低噪声并保证稳定性，但需遵循厂方对电容容值与ESR的推荐范围。注意评估插入压降与散热条件对最大连续输出电流的影响。最后，采购与替换时请以完整料号（ISL80113IRAJZ-T）和厂商数据手册为准。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
