WMSIC Electronic Components

RENESAS 2SK1317-E 2SK1317

Model2SK1317-E
PackageTO-3P
BrandRENESAS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
RENESAS 2SK1317-E
Type
RENESAS
Unit
Electronic Component
Minimum package
360 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
RENESAS
Electronic Component
2SK1317-E
Electronic Component
1
Package
TO-3P
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
6.333g
Electronic Component
1
Electronic Component
BM0257247460
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
100W
Gate Voltage(Vgs)
±20V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

2SK1317-E 产品概述

一、概述

2SK1317-E 是瑞萨(RENESAS)推出的一颗高压 N 沟道场效应晶体管(MOSFET),针对需要高耐压与中等电流能力的电力电子场合设计。器件的主要静态和动态参数包括:漏源耐压 Vdss = 1.5 kV、连续漏极电流 Id = 2.5 A、导通电阻 RDS(on) = 12 Ω(在 Id=2 A 条件下测量)、耗散功率 Pd = 100 W、阈值电压 Vgs(th) = 4 V、反向传输电容 Crss = 60 pF,工作温度范围为 -55 ℃ ~ +150 ℃,封装为 TO-3P。单颗器件适用于高压开关与脉冲功率应用。

二、主要特性与优势

  • 极高的耐压能力(1.5 kV),适合中高压开关场合;
  • 适用于脉冲及中等平均功率输出(Pd = 100 W),配合良好散热可实现稳定工作;
  • 相对较小的栅-漏电容(Crss = 60 pF)有利于降低开关损耗与电磁干扰,在高压开关频率下更易控制;
  • TO-3P 封装便于与大体积散热器机械固定与热连接,适合功率级模块化设计。

三、典型应用场景

  • 高压开关电源(SMPS)与 PFC 前端;
  • 工业电源与电机驱动中需要高耐压开关的半桥/全桥拓扑;
  • 激光驱动、脉冲功率发生器、逆变器中的高压侧元件;
  • 作为高压保护或限流元件使用于测试设备与高压供电系统。

四、设计注意事项

  • 尽管器件额定耗散为 100 W,但实际能耗取决于散热设计与占空比。建议在系统设计时采用合适的散热器与热界面材料,并计算结—外壳与外壳—环境的热阻以保证结温在安全范围内。
  • 阈值电压 Vgs(th) = 4 V 表明需要较充分的栅极驱动电压以获得低 RDS(on)。在不清楚最大允许栅极电压的情况下,请参考厂家完整数据手册并采用规范的栅极驱动设计(包括驱动电压幅值、上升/下降时间控制与栅极电阻)。
  • 1.5 kV 的高压等级对 PCB 布局、爬电距离和绝缘要求提出较高要求,务必遵循相关安规与工艺间距规范,防止击穿与闪络。
  • 在开关过程中可能产生高幅值的电压尖峰与寄生振荡,建议配合适当的阻尼、RC 吸收或 TVS 进行浪涌保护,并在布局上最小化寄生电感。

五、封装与可靠性

TO-3P 封装兼顾机械强度与热性能,适于在电源模块中直接螺栓安装至金属散热片。器件工作温度范围宽(-55 ℃ ~ +150 ℃),适合严苛环境;但长期使用可靠性依赖于实际结温控制与工作应力管理,建议在原理验证阶段进行热循环与应力测试。

六、选型与调配建议

在系统选型时,除满足电压、电流与功率要求外,还应关注开关频率下的开关损耗、栅极驱动能力与系统 EMI 控制。若需更低导通损耗或更高频率操作,可考虑并联多颗器件或选用适配的低 RDS(on) 器件;若不确定具体参数或需要替代器件,请参考瑞萨官方数据手册或咨询厂家技术支持以获得完整电气、热特性与封装尺寸资料。

注:本文基于提供的基本参数编写,设计与使用时应以瑞萨正式数据手册与应用说明为准。

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