Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
RENESAS 2SK2225-E 2SK2225
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- RENESAS 2SK2225-E
- Type
- RENESAS
- Minimum package
- 360 管
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- RENESAS
- Electronic Component
- 2SK2225-E
- Electronic Component
- 1
- Package
- TO-3PFM
- Electronic Component
- 1 N
- Type
- N
- Electronic Component
- MOSFET
- Electronic Component
- 6.333g
- Electronic Component
- 1
- Electronic Component
- BM0257222499
- Operating Temperature
- 55℃~+150℃
- Power Dissipation(Pd)
- 50W
- Electronic Component
- Electronic Component
- Electronic Component
- 360
- Voltage(Vdss)
- 1.5kV
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
2SK2225-E 产品概述
一、产品简介
2SK2225-E 是瑞萨（RENESAS）推出的一款高电压 N 沟道功率 MOSFET，设计用于高压开关与功率传输场合。器件额定漏源电压 Vdss 为 1.5kV，适合在高压环境下工作，同时提供可靠的热耗散能力与宽工作温度范围（-55℃ 至 +150℃）。
二、主要参数
- 类型：N 沟道 MOSFET
- 漏源电压（Vdss）：1.5 kV
- 连续漏极电流（Id）：2 A
- 导通电阻（RDS(on)）：12 Ω @ Vgs = 15 V
- 耗散功率（Pd）：50 W
- 阈值电压（Vgs(th)）：4 V @ Id = 1 mA
- 输入电容（Ciss）：66 pF
- 反向传输电容（Crss）：60 pF
- 输出电容（Coss）：125 pF
- 工作温度：-55 ℃ ~ +150 ℃
- 封装：TO-3PFM
- 单位数量：1 个（规格基于单片器件）
三、性能特点
- 高耐压：1.5 kV 的耐压使其适用于中高压开关电源、脉冲供电和高压转换器。
- 中低栅电容：Ciss = 66 pF 表明栅极加载相对较小，有利于快速开关和降低驱动能量。
- 适中导通电阻：RDS(on) 为 12 Ω（15 V 驱动），表明在高压低电流条件下使用更为合适。
- 宽温区与良好功率耗散能力：50 W Pd 与 -55~+150 ℃ 的工作温度提升了环境适应性，但实际热管理依赖于散热设计与封装安装。
四、典型应用
- 高压开关电源与升压转换器
- 中高压脉冲电路（如激光驱动、脉冲供电）
- 工业高压驱动与保护电路
- 需要高 Vdss、低电流承载的电源前端或整流开关
五、使用与设计注意事项
- 栅极驱动：尽管 Vgs(th) ≈ 4 V，但器件在 15 V 驱动时给出 RDS(on) 参数，建议采用足够的栅极驱动电压以降低导通损耗。
- 热管理：Pd 标称为 50 W，但需结合封装、散热器与实际工作条件计算结到环境的热阻并设计散热系统。
- 开关保护：高压开关会产生较大 dv/dt 和能量回冲，建议配合合适的栅阻、吸收网络（RCD 或 TVS）以及合理的 PCB 布局以控制过压与振铃。
- 可靠性与绝缘：在高压电路中注意器件间距离、爬电距离和绝缘处理，避免表面放电与击穿。
- 参考原厂资料：详细的极限参数、单脉冲能量、SOA 与转换特性请以瑞萨官方数据手册为准。
六、封装与可靠性
TO-3PFM 封装便于机械安装与散热器固定，适合需要良好热接触的高压应用。器件的环境与温度等级使其在工业级和严苛环境中具备较高可靠性，但最终设计应通过热仿真与实际验证确保长期稳定运行。
总之，2SK2225-E 以其 1.5 kV 的高耐压特性、较小的栅电容和工业级温度范围，适合于高压、低至中等电流的功率开关场合；在设计时应重视栅驱动、散热与过压保护以发挥器件最佳性能。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
