WMSIC Electronic Components

RENESAS PS2811-1-F3-A PS2811

ModelPS2811-1-F3-A
PackageSSOP-4
BrandRENESAS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 22+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RENESAS PS2811-1-F3-A
Type
RENESAS
Minimum package
7000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RENESAS
Electronic Component
PS2811-1-F3-A
Electronic Component
1
Package
SSOP-4
Electronic Component
Transistor Output Optocoupler
Electronic Component
1g
Electronic Component
1
Electronic Component
5us
Electronic Component
BM0264899765
Operating Temperature
55℃~+100℃
Load Voltage
40V
Type
DC
Output Current
40mA
Output Type
Photoelectric Transistor
Output Channel Count
1

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PS2811-1-F3-A 产品概述

一、器件简介

PS2811-1-F3-A 为 RENESAS(瑞萨)出品的小型光电耦合器,采用 4 引脚 SSOP-4 封装,输入为直流 LED,输出为光电三极管。器件通过光耦隔离输入与输出,适用于需要信号隔离与逻辑电平转换的场合,体积小、安装方便,适合表面贴装工艺。

二、主要电气参数

  • 输入正向压降(Vf):1.15 V(典型)
  • 正向电流(If,最大):50 mA
  • 输出类型:光电三极管,最大输出电流(集电极电流):40 mA
  • 集—射极饱和电压(VCE(sat)):约 300 mV(典型测试点:Ic=1 mA,If=0.2 mA)
  • 直流反向耐压(Vr):6 V
  • 负载电压(最大 VCEO):40 V
  • 隔离耐压(Vrms):2.5 kV
  • 电流传输比(CTR):最小 100%,最高可达 400%(随 If、温度与测试条件变化)
  • 响应速度:上升时间 tr ≈ 4 μs,下降时间 tf ≈ 5 μs
  • 工作温度范围:-55 ℃ ~ +100 ℃

三、关键特性与优势

  • 高隔离电压(2.5 kVrms),保障输入与输出之间良好安全隔离。
  • 宽 CTR 范围(100%–400%),便于在低驱动电流条件下仍获得充足输出电平。
  • 低 VCE(sat) 有助于减少开关损耗并提高输出驱动能力。
  • 小型 SSOP-4 封装,便于在空间受限的 PCB 上实现表贴安装与自动化组装。

四、典型应用场景

  • MCU 与高压/噪声侧电路的信号隔离与接口保护。
  • 电源模块的反馈与监控信号隔离。
  • 工业控制、家电与通信设备中的低频开关与逻辑隔离。
  • 需要直流隔离且对速度要求不高(微秒级)的场合。

五、选型与使用建议

  • 若需更高隔离或更快响应,请参考 RENESAS 系列中更高规格或高速型型号。
  • 设计时根据目标输出电流选择合适的输入 If 与限流电阻,同时留意 CTR 的散布以保证最差情况仍能满足逻辑阈值。
  • 输出侧应配置合适的上拉电阻与吸收保护,防止瞬态电压超限。
  • 在耐压和安全相关应用中,遵循 PCB 间距与爬电距离规范,确保器件隔离等级的实现。

如需标准电气特性曲线、封装尺寸图或典型应用电路图,可根据具体需求进一步提供数据手册摘录与参考设计。

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