WMSIC Electronic Components

RENESAS R5F100ACASP#10 R5F100ACASP

ModelR5F100ACASP#10
PackageLSSOP-30-6.1mm
BrandRENESAS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
RENESAS R5F100ACASP#10
Type
RENESAS
Unit
Electronic Component
Minimum package
1680 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
RENESAS
Electronic Component
R5F100ACASP#10
Electronic Component
1
Package
LSSOP-30-6.1mm
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
1.2g
CPU
16 Bit
CPU
RL78
I / O
21
RAM
2KB
Electronic Component
1
ADC
10bit
EEPROM
4KB
Electronic Component
BM0257410094

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

R5F100ACASP#10 产品概述

一、核心规格概览

R5F100ACASP#10 是瑞萨(RENESAS)基于 RL78 内核的 16 位单片机,面向对成本、功耗与可靠性有平衡要求的嵌入式应用。主要规格如下:

  • CPU:RL78,16 bit,最高主频 32 MHz;
  • 程序存储:32 KB Flash;
  • 数据存储:2 KB RAM,4 KB EEPROM;
  • I/O:21 个通用 I/O;
  • ADC:10 bit 分辨率;
  • 振荡器:内置振荡器;
  • 工作电压:1.6 V ~ 5.5 V;
  • 工作温度:-40 ℃ ~ +85 ℃;
  • 封装:LSSOP-30(6.1 mm)。

二、功能亮点与优势

R5F100ACASP#10 在小尺寸封装下提供了完整的嵌入式控制能力,适合空间受限且对非易失性数据有需求的终端产品。32 KB Flash 与 4 KB EEPROM 的组合,使得程序与数据存储分离,便于固件升级与参数保存。10 位 ADC 适合对模拟量进行中等精度采样。1.6 V~5.5 V 的宽电压范围支持多种电源方案(包括单节锂电或两节 NiMH),且-40℃ 至 +85℃ 的工业级温度覆盖常见工业与消费场景。

三、封装与外设布局

LSSOP-30 小型封装利于紧凑型 PCB 布局,21 个 I/O 可直接驱动多个传感器、按键与指示灯。内置振荡器减少外部时钟元件需求,简化 BOM 与系统设计。在实际设计时应注意引脚功能分配与电源去耦,保证模拟采样(ADC)和数字开关的相互干扰最小化。

四、典型应用场景

  • 便携式仪表与传感器节点:低电压启动与内置振荡器有利于电池供电方案;
  • 家电与白色家电控制面板:非易失性参数存储与多路 I/O 支持用户设置与状态指示;
  • 工业控制与过程监测:工业温度等级与较稳定的定点控制逻辑;
  • 智能楼宇终端:门禁、照明控制、环境监测等对成本与可靠性要求均适配。

五、设计与选型建议

  • 电源与去耦:在 VCC 引脚附近放置足够的旁路电容,保证 ADC 参考稳定性;
  • ADC 采样:对模拟信号进行滤波与适当的采样保持,以提升 10 bit 分辨率下的测量稳定性;
  • EEPROM 使用:将需长期保存的配置与校准数据放入 EEPROM,可降低 Flash 擦写次数;
  • 温度与布局:保证散热通道与敏感模拟信号走线分离,避免热漂与干扰影响精度。

六、开发与量产注意事项

R5F100ACASP#10 可配合瑞萨提供的开发工具链与调试器进行固件开发与验证。量产时建议建立可靠的编程与测试流程,包括 Flash/EEPROM 烧录、功能自检与边界温度测试,以保证产品一致性与长期可靠性。

总结:R5F100ACASP#10 在小封装、低电压与工业温度范围内提供均衡的存储与 I/O 能力,适合多类成本敏感但对可靠性有要求的嵌入式应用。

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