WMSIC Electronic Components

RENESAS ISL21080DIH312Z-TK ISL21080DIH312Z

ModelISL21080DIH312Z-TK
PackageSOT-23
BrandRENESAS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RENESAS ISL21080DIH312Z-TK
Type
RENESAS
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RENESAS
Electronic Component
ISL21080DIH312Z-TK
Electronic Component
1
Package
SOT-23
Electronic Component
Voltage Reference IC
Electronic Component
±0.6%
Electronic Component
0.258g
Electronic Component
1
Electronic Component
BM0264249229
Operating Temperature
40℃~+85℃
Operating Voltage
2.7V~5.5V
Electronic Component
50ppm/℃
Output Voltage
1.25V
Output Current
7mA
Output Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ISL21080DIH312Z-TK 产品概述

一般介绍

ISL21080DIH312Z-TK 是一款高精度的电压基准芯片,属于瑞萨(RENESAS)公司的系列产品。此芯片设计用于提供稳定的固定输出电压,广泛应用于各种电子设备和电路中,如模拟电路、信号处理、精密测量等。在现代电子设计中,电压基准是确保系统性能和稳定性的关键组件之一,其输出电压的精度和温度特性直接影响整个系统的可靠性和精确性。

主要参数

ISL21080DIH312Z-TK 的主要技术参数如下:

  • 输出电流:此芯片能够提供高达 7mA 的输出电流,适用于驱动多种负载。
  • 输入电压范围:工作电压范围为 2.7V 到 5.5V,这使得该芯片在不同电源电压条件下均能稳定工作,适合便携式电子设备和嵌入式系统。
  • 输出电压:固定输出电压为 1.25V,容差范围为 ±0.6%,确保提供准确、稳定的电压参考。
  • 电流供电:芯片的供电电流为极低的 1.5µA,极大地降低了功耗,适合对功耗敏感的应用场合。
  • 噪声特性:在 0.1Hz 至 10Hz 范围内的噪声为 30µVp-p,和 10Hz 至 10kHz 范围内的噪声为 52µVrms,这使得其在高精度要求的应用中表现优异,能够有效减少对信号性能的干扰。
  • 温度系数:此产品的温度系数为 50ppm/°C,表明在不同温度环境下,输出电压的变化非常小,适应了宽广的工作温度范围。

工作温度

ISL21080DIH312Z-TK 的工作温度范围为 -40°C 至 85°C,使其在恶劣环境下也能稳定运行,适合汽车电子、工业控制及消费电子产品。

封装与安装

该芯片采用 SOT-23-3 表面贴装型封装,具有体积小、重量轻的特点,方便在现代电子产品中实现高密度布板设计。

应用场景

ISL21080DIH312Z-TK 适用于多种应用场景,包括但不限于:

  • 精密模拟电路:提供稳定的参考电压以确保信号的高质量处理。
  • ADC/DAC 参考电压:为模数转换器(ADC)和数模转换器(DAC)提供高精度的参考电压。
  • 汽车电子:在汽车应用中提供可靠的电压基准,确保系统的稳定性。
  • 各种便携式设备:由于其低功耗特性,ISL21080DIH312Z-TK 适合用于手持设备和其他对能耗有严格要求的产品。

总结

ISL21080DIH312Z-TK 是一款功能强大且精准的电压基准芯片,具备低功耗、高稳定性和小型化封装等特点。因此,广泛应用于需要高精度和稳定电压参考的各种电子设备中。其高性能的噪声特性和宽的工作温度范围使其在多种复杂环境中都能保持卓越的性能,成为工程师们设计电路时的理想选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.