WMSIC Electronic Components

RENESAS UPD720202K8-701-BAA-A UPD720202K8

ModelUPD720202K8-701-BAA-A
PackageQFN-48(7x7)
BrandRENESAS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RENESAS UPD720202K8-701-BAA-A
Type
RENESAS
Minimum package
2080 托盘

Technical parameters

Electronic Component
Controller
Electronic Component
Electronic Component
Electronic Component
USB
Electronic Component
RENESAS
Electronic Component
UPD720202K8-701-BAA-A
Electronic Component
1
Package
QFN-48(7x7)
Interface
USB
Electronic Component
USB 3.0
Electronic Component
USB Converter IC
Electronic Component
0.11g
Electronic Component
1
Electronic Component
BM0257222500
Operating Temperature
0°C ~ 85°C
Voltage
3.3V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

UPD720202K8-701-BAA-A 产品概述

一、概览与定位

UPD720202K8-701-BAA-A 是瑞萨(RENESAS)系列的 USB 3.0 主机控制器芯片,封装为 48 引脚 QFN(7×7 mm),工作电源为 3.3V,适用于商用温度范围(0°C ~ 85°C)。该器件面向需要实现 USB 3.0(SuperSpeed)主机功能的系统与模块,兼容 USB2.0/USB1.1 设备,并可作为桌面计算、嵌入式平台、外设扩展与存储接口等场景的核心控制器件。

主要基础参数(摘要)

  • 协议:USB
  • 功能:主机控制器(USB Host Controller)
  • 接口:USB(下游端口用于连接外设)
  • 标准:USB 3.0(向下兼容 USB 2.0/1.1)
  • 工作温度:0°C ~ 85°C
  • 电压(供电):3.3V
  • 品牌:RENESAS(瑞萨)
  • 封装:QFN-48(7×7 mm)

二、主要特性与功能亮点

  • 支持 USB 3.0 SuperSpeed(最高 5 Gbps)通信,向下兼容 USB 2.0/1.1,能够满足高速外设(如外置 SSD、高清摄像头、快速数据采集设备等)的带宽需求。
  • 符合 USB 3.0 协议的链路和电源管理机制,支持常用的电源状态切换与带宽管理,有助于系统节能与热管理。
  • 3.3V 供电,便于同主板与嵌入式系统的电源对接与设计集成。
  • 小型 QFN-48(7×7)封装,利于空间受限的应用场合,如移动底板、迷你 PC、扩展卡与外壳内置模块。

三、典型应用场景

  • 台式机与笔记本扩展接口(外接扩展坞、前置/后置 USB 面板)
  • 工业与嵌入式系统的外设连接(数据采集、工业相机、条码扫描器等)
  • 外置高速存储设备(移动硬盘盒、固态硬盘外壳)
  • 多口 USB 集线器 / 供电管理模块(与电源开关/过流保护电路结合)
  • 多媒体设备与消费电子(流媒体设备、游戏周边、高清传输接口)

四、系统集成建议(硬件层面)

  • 电源与旁路:3.3V 电源应提供足够电流并在芯片电源引脚附近布置低值陶瓷旁路电容(例如 0.1 μF、1 μF),推荐在入口处增加稳定的电源滤波与去耦网络以降低噪声。
  • USB SuperSpeed 差分走线:下游 SuperSpeed 差分对(TX/RX)采用 90 Ω 差分阻抗控制,差分线对长度匹配、避免急转弯与串扰;布线时保持差分对对称、并尽量缩短过孔数量。
  • 接地与散热:QFN 底部常带散热焊盘(exposed paddle),建议在底部开铜并配合热通孔(thermal vias)接地到内部层以提升散热性能;地平面连续且靠近信号层可降低 EMI。
  • ESD 与浪涌保护:外部 USB 端口应加装 ESD 二极管、共模扼流圈与 TVS 器件,保护下游端口与芯片引脚免受静电或感性浪涌损伤。
  • PCB 布局注意:将高速信号与噪声敏感的模拟/电源电路分开,关键走线避免跨区穿越;为时钟与参考信号保留清晰回流路径,降低干扰。

五、软件与驱动支持

  • 瑞萨及生态厂商通常提供主流操作系统(Windows、Linux 等)的驱动支持,系统集成时应核实并使用与器件序列号和固件版本匹配的驱动包。
  • 在开发初期,应使用厂商提供的参考设计与应用笔记进行验证,以加速驱动、枚举与性能调试。

六、可靠性与封装注意事项

  • 工作温度范围为 0°C ~ 85°C,适合商用与多数工业/消费类应用;对更宽温度需求(如 -40°C ~ 85°C)需向供应商确认是否有相应版本或进行系统级温度控制。
  • QFN-48(7×7)封装在手工焊接与回流工艺时对焊膏印刷、回流曲线与焊盘尺寸较为敏感,建议参考瑞萨的封装与焊接规范(推荐 JEDEC 回流曲线与焊盘设计指南)。
  • 在高密度封装环境下,底部 exposed pad 的焊接质量直接影响热阻,采用足够数量的热通孔并保证良好返流焊接可提升散热性能与长期可靠性。

七、选型与使用建议

  • 在选型时,关注系统对下游端口数量、带宽需求、驱动支持及认证(USB-IF/EMC)要求,若需要多端口扩展可结合外部开关芯片或集线器 IC 设计。
  • 在产品开发初期,建议获取瑞萨的参考电路、评估板与相关应用说明,进行信号完整性、兼容性与热试验,确保整机在目标工作条件下稳定运行。
  • 若产品面向工业或严苛环境,应评估是否需要更宽温度等级或额外的封装/PCB 保护措施(如涂覆、防潮)。

总结 UPD720202K8-701-BAA-A 以其 USB 3.0 主机控制功能、3.3V 供电与小型 QFN 封装,为需要高速 USB 主机接口的系统提供了紧凑可靠的解决方案。通过合理的电源设计、差分走线控制与热管理,以及配套的驱动支持与参考设计,能在台式机外设、嵌入式设备和外置存储等多种应用中实现稳定、高效的 USB 主机功能。若需更详细的引脚分配、时序、寄存器与参考电路,建议查阅瑞萨最新版 Datasheet 与 Design Guide。

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