WMSIC Electronic Components

RENESAS R5F104BCAFP#10 R5F104BCAFP

ModelR5F104BCAFP#10
PackageLQFP-32(7x7)
BrandRENESAS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
RENESAS R5F104BCAFP#10
Type
RENESAS
Unit
Electronic Component
Minimum package
2000 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
RENESAS
Electronic Component
R5F104BCAFP#10
Electronic Component
1
Package
LQFP-32(7x7)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
0.993g
CPU
16 Bit
CPU
RL78
I / O
22
RAM
4KB
Electronic Component
1
ADC
10bit
EEPROM
4KB
Electronic Component
BM0257410096

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

R5F104BCAFP#10 产品概述

R5F104BCAFP#10 是瑞萨(RENESAS)基于 RL78 系列的 16 位微控制器,面向低功耗、成本敏感且需一定运算与模拟采样能力的嵌入式应用。器件具备 32KB 的片上 FLASH 程序存储、4KB RAM 与 4KB EEPROM,最高工作主频可达 32MHz,内置振荡器并支持宽电源电压范围与工业级温度范围,适合多种工业与消费类产品设计。

一、主要规格亮点

  • CPU 内核:RL78,16 bit,最高主频 32MHz。
  • 存储:32KB FLASH 程序存储、4KB RAM、4KB EEPROM。
  • I/O 与外设:22 个通用 I/O 引脚。
  • 模数转换:10-bit ADC,适合常规传感器信号采集。
  • 振荡器:内置高精度振荡源,简化外部晶振设计。
  • 电源与温度:工作电压 1.6V ~ 5.5V,工作温度 -40°C ~ +85°C。
  • 封装:LQFP-32(7 mm × 7 mm)。

二、功能与应用场景

R5F104BCAFP#10 适用于低至中等复杂度的控制与采集场景,例如家电控制面板、便携式测量仪器、电池供电设备、楼宇控制与小型工业控制器。内置 EEPROM 使参数存储与标定数据保存更加方便,10-bit ADC 可满足温度、光照、压力等传感器的常规分辨率需求。

三、片上资源与外设建议

芯片提供足够的片上存储与 I/O,用于实现简单的控制算法与状态机。建议按功能分配 I/O 引脚、预留若干引脚用于调试接口。ADC 输入应使用合适的采样电路与抗别扰处理,若需提高 ADC 精度,注意参考地与模拟地的布局分离、去耦和参考电压稳定。

四、电源与时钟设计要点

  • 电源:器件支持宽电压输入(1.6V–5.5V),在 3.3V 或 5V 系统中均能稳定工作。建议在 VCC 近端放置 0.1µF 和 1µF 的去耦电容以抑制瞬态。
  • 时钟:内置振荡器可减少外部元件,但对高精度时序或低抖动需求,建议使用外部晶振或校准内振荡器。启动与低功耗模式的时序需参考数据手册,合理选择省电策略以延长电池寿命。

五、软件与开发支持

芯片兼容 RL78 的开发生态,可使用瑞萨官方的 e2 studio、CC-RL、かい方等编译与调试工具。开发时注意 FLASH 与 EEPROM 的写次数限制与擦写时序,合理安排固件升级与参数保存策略。利用片上中断与定时器可构建实时响应能力,合理使用低功耗模式实现功耗优化。

六、封装与热机械注意事项

LQFP-32(7×7 mm)封装适合批量贴片生产,焊接时注意回流曲线与引脚热均衡,避免过热导致封装应力。布局时保证模拟地与数字地的合理分割,共地点靠近电源入口以减少噪声耦合。

七、设计与验证建议

  • ADC:在设计 ADC 输入通道时,使用缓冲器或RC 滤波以减少源阻抗影响,确保采样电容充电充分。
  • EMC/抗干扰:敏感引脚加滤波,关键信号走短线并屏蔽噪声源。
  • Flash/EEPROM 管理:对写入频率、错误处理与掉电保护做策略设计(例如磨损均衡与写入校验)。
  • 调试验证:预留 SWD/ICE 接口和复位、掉电监测脚,方便在开发与量产测试中进行编程与故障定位。

总结:R5F104BCAFP#10 提供了均衡的计算、存储与模拟采样能力,适合对成本、功耗与可靠性有综合要求的嵌入式应用。详细时序、电气规范与寄存器说明请参考瑞萨官方数据手册以获得完整设计指导。

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