WMSIC Electronic Components

RENESAS AT45DB161E-MHD-T AT45DB161E

ModelAT45DB161E-MHD-T
PackageUDFN-8(5x6)
BrandRENESAS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RENESAS AT45DB161E-MHD-T
Type
RENESAS
Minimum package
6000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RENESAS
Electronic Component
AT45DB161E-MHD-T
Electronic Component
1
Package
UDFN-8(5x6)
Electronic Component
NOR FLASH
Electronic Component
0.4g
Electronic Component
1
Features
positions
Electronic Component
BM0264684463
Electronic Component
16Mbit
Operating Voltage
2.3V~3.6V
Current
25uA
Interface Type
SPI
Electronic Component
100000
Clock Frequency(fc)
85MHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AT45DB161E-MHD-T 产品概述

一、产品简介

AT45DB161E-MHD-T 是 Renesas(瑞萨)旗下的 Single SPI DataFlash 存储器,容量 16 Mbit(2 MByte),面向需要非易失性代码与数据存储的嵌入式系统。该器件支持单线 SPI 接口和 Binary Page Mode(页大小 528 字节),最高时钟频率可达 85 MHz,兼顾高性能读写与低功耗待机特性,适合工业级工作温度(-40°C 至 +85°C)应用场景。

二、主要特性

  • 存储容量:16 Mbit(2 MByte)
  • 接口类型:单 SPI(Serial Peripheral Interface),兼容标准 SPI 命令集与 DataFlash 指令
  • 页模式:528 字节 Binary Page Mode,便于页级编程与页内随机访问
  • 时钟频率:最高 fc = 85 MHz,支持高速数据传输
  • 工作电压:典型 3.0V,工作范围覆盖宽电压域(参考 2.3V ~ 3.6V,部分资料也列示 2.5V ~ 3.6V)
  • 待机电流:25 μA(低功耗待机,利于电池供电系统)
  • 擦写寿命:至少 100,000 次擦写周期
  • 数据保持(TDR):典型 20 年
  • 温度范围:-40°C 至 +85°C(工业级)
  • 品牌与封装:RENESAS(瑞萨),UDFN-8 (5 × 6 mm),带卷带(Tape & Reel)包装

三、功能与保护机制

AT45DB161E 提供多重写保护与可靠性功能,以满足对数据完整性和防篡改的需求:

  • 硬件写保护:通过写保护引脚(WP# 或类似)可快速对整个器件或指定区域实施物理写保护。
  • 绝对写保护:支持锁定功能,使特定存储区域永久只读(需在器件上设置并确认)。
  • 软件写保护:通过命令对页/扇区配置写保护标志,便于在运行时动态管理保护策略。
  • 上电复位(POR):上电复位电路确保电源稳定后器件进入已知初始状态,避免不完整操作导致的数据损坏。

四、电气与环境规格(关键参数)

  • 电源电压(VCC):2.3 V ~ 3.6 V(请参考具体数据手册确认典型 3.0 V 工作点)
  • 最大 SPI 时钟:85 MHz(读写顺序需遵循时序表)
  • 待机电流:约 25 μA(具体条件参见数据手册)
  • 擦写寿命:100k 次(典型)
  • 数据保留:20 年(典型)
  • 工作温度:-40°C 至 +85°C

五、封装与机械信息

  • 封装类型:UDFN-8(也标注为 DFN 5 × 6 mm),适合空间受限的表贴设计
  • 包装:Tape & Reel,便于批量 SMT 贴装生产
  • 引脚排列与焊盘建议请参照封装机械图与 PCB Land Pattern 指南,确保焊接可靠性与热管理

六、典型应用场景

  • 固件与配置存储:保存 MCU 引导代码、固件映像与系统配置数据
  • 工业设备:数据记录、配置备份、校准参数存储(工业温度范围支持)
  • 消费与便携设备:需要高密度非易失性存储且对功耗敏感的产品
  • 智能传感与物联网终端:存储设备证书、日志、传感器校准数据等
  • 汽车电子(部分车辆域):在满足特定 AEC/车规认证前提下用于辅助存储

七、设计注意事项与建议

  • 电源与时序:推荐在 VCC 上使用合适的去耦电容,保证在高频读写与片选切换时电源稳定。上电和下电序列需满足 POR 要求,避免长时间处于不确定状态。
  • 片选与 SPI 时序:在系统中应确保 CS#、SCLK、MOSI、MISO 的时序满足器件规范,特别是在接近 85 MHz 的高速模式下,注意 PCB 走线阻抗控制与最小化串扰。
  • 写保护策略:在关键数据存储场景建议同时使用硬件写保护与软件写保护,并在生产或出厂时对不可更改分区设置绝对写保护。
  • 擦写与耐久管理:尽管器件支持 100k 擦写周期,仍建议对频繁写入区域实施磨损均衡或日志式写入,延长整体寿命。
  • 散热与封装安装:UDFN 封装热量可通过 PCB 散热垫与多层接地/电源平面管理,避免长期高温影响数据保持与可靠性。
  • 兼容性:AT45DB161E 的 SPI/DataFlash 命令和分页机制与常见 MCU 的 SPI 控制器高度兼容,但建议在软/硬件驱动中实现对 DataFlash 特定命令的支持(例如页面编程、页面读出、保护位设置等)。

总结:AT45DB161E-MHD-T 以 16Mbit 的容量、528 字节页模式和高达 85MHz 的 SPI 速率为核心优势,配合多重写保护、低待机电流和工业级温度范围,适合对可靠性、寿命和性能有明确要求的嵌入式存储应用。采购与设计时请以官方数据手册为准,针对关键参数(电源、电气时序、封装焊盘)按照厂商建议进行实现。

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