WMSIC Electronic Components

RENESAS ISL3170EIUZ-T ISL3170EIUZ

ModelISL3170EIUZ-T
Package10-MSOP
BrandRENESAS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RENESAS ISL3170EIUZ-T
Type
RENESAS
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RENESAS
Electronic Component
ISL3170EIUZ-T
Electronic Component
1
Package
10-MSOP
Type
Transceiver
Electronic Component
RS-485 / RS-422IC
Electronic Component
0.48g
Electronic Component
256
Electronic Component
1
Electronic Component
BM0264858901
Operating Temperature
40℃~+85℃
Operating Voltage
3.3V
Receiver
1
Data
20Mbps
Communication
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ISL3170EIUZ-T 收发器产品概述

一、产品核心定位与基本属性

ISL3170EIUZ-T是瑞萨电子(RENESAS)推出的单驱动器/单接收器组合式RS422/RS485收发器,专为工业级中高速数据传输场景设计。该器件采用10-MSOP微型封装,以3.3V单电源供电,兼容RS422全双工与RS485半双工通信协议,是实现短至中距离(典型1200米@1Mbps)可靠数据传输的核心器件,广泛适配工业自动化、楼宇控制等场景。

二、关键性能参数解析

1. 电气与通信性能

  • 工作电压:3.3V单电源供电,无需额外负电源,简化电路设计与布线;
  • 数据速率:支持最高20Mbps差分传输,满足工业数据采集、机器人控制等中高速需求;
  • 协议兼容性:同时支持RS422(全双工,4线制)和RS485(半双工,2线制),通过硬件配置可灵活切换工作模式;
  • 总线负载:RS485模式下可驱动最多32个总线节点,扩展系统通信容量。

2. 抗干扰与可靠性

  • 静电保护(ESD):采用±15kV人体模型(HBM)静电防护设计,有效抵御工业现场静电干扰,降低器件损坏风险;
  • 共模抑制比(CMRR):典型值≥60dB(1kHz),抑制总线共模噪声,保障信号完整性;
  • 热插拔能力:支持总线热插拔,避免设备带电插拔时的信号冲突与器件损坏。

3. 功耗特性

  • 静态电流:典型值仅1.5mA,待机模式下进一步降至微安级(典型10μA),适合电池供电或低功耗系统(如远程传感器节点)。

三、封装与环境适应性

1. 封装规格

采用10-MSOP(微型小外形封装),引脚间距0.5mm,封装尺寸(典型值)为3.0mm×4.9mm,相比传统DIP封装节省约70% PCB空间,适配高密度嵌入式模块、小型PLC等紧凑设计。

2. 温度与环境适应

  • 工作温度范围:-40℃~+85℃,覆盖工业级宽温需求(如户外传感器、车间自动化设备);
  • 湿度适应性:满足JEDEC J-STD-020湿度标准,可在高湿度环境下长期稳定工作。

四、典型应用场景

ISL3170EIUZ-T凭借高速、可靠、宽温适应的特性,广泛应用于:

  1. 工业自动化:PLC与远程I/O模块通信、生产线传感器数据采集、机器人控制系统交互;
  2. 楼宇自动化:HVAC(暖通空调)监控、门禁安防联网、智能照明控制;
  3. 消费电子:智能家居网关与传感器节点通信、智能电表数据传输;
  4. 通信设备:短距离高速数据链路(如基站辅助设备)、数据采集系统总线扩展。

五、产品优势与价值

  1. 协议灵活性:兼容RS422/RS485双协议,无需更换器件即可适配不同通信模式,降低系统设计成本;
  2. 高速与抗干扰平衡:20Mbps速率满足中高速需求,±15kV ESD与高CMRR保障恶劣环境下的信号完整性;
  3. 小型化设计:10-MSOP封装适配紧凑设备,符合电子设备小型化趋势;
  4. 工业级可靠性:-40℃~+85℃宽温范围+瑞萨品质保障,适合稳定性要求严苛的工业场景;
  5. 低功耗特性:微安级待机电流延长电池供电系统工作时间,降低功耗成本。

该器件通过瑞萨严格的可靠性测试,可满足工业级应用的长期稳定运行需求,是替代传统RS485收发器的高性价比选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.