Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
RENESAS X9C503SIZT1
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- RENESAS X9C503SIZT1
- Type
- RENESAS
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- RENESAS
- Electronic Component
- X9C503SIZT1
- Electronic Component
- 1
- Package
- SOIC-8
- Electronic Component
- positions
- Electronic Component
- ±20%
- Electronic Component
- 0.107g
- Electronic Component
- 50kΩ
- Electronic Component
- 100
- Electronic Component
- 1
- Channel Count
- 1
- Features
- Electronic Component
- Electronic Component
- BM0257410087
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 4.5V~5.5V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
X9C503SIZT1 — 数字电位器产品概述
一、产品简介
X9C503SIZT1 是瑞萨（RENESAS）系列单通道数字电位器，标称阻值 50 kΩ，100 抽头（100 步）。器件采用 SOIC-8 封装，工作电压 4.5 V ~ 5.5 V，工作温度范围 -40 ℃ ~ +85 ℃，阻值变化为线性刻度（Linear）。其控制接口采用经典的脉冲/方向（INC / U/D）结合片选（CS）方式，便于在微控制器或数字逻辑系统中实现无刷调节。
二、主要规格要点
- 阻值：50 kΩ（标称）
- 抽头数：100 步（每步约 50 kΩ/100 ≈ 500 Ω）
- 通道数：1（单通道）
- 精度：±20%（阻值公差）
- 温度系数：±300 ppm/℃
- 工作电压：4.5 V ~ 5.5 V
- 工作温度：-40 ℃ ~ +85 ℃
- 静态电流：约 200 μA（典型）
- 阻值变化：线性刻度
- 封装：SOIC-8（8 引脚）
- 控制接口：INC（增量脉冲）、U/D（上下方向）、CS（片选）
三、功能与特性
- 通过对 INC 引脚施加脉冲并由 U/D 引脚设置脉冲方向，实现对滑动端（Wiper）在 A-B 端之间的步进调节，控制简单、可靠。
- 线性阻值分布适合作阻值分压、音量/对比度调节、基准微调等需要等步长调节的场合。
- 低静态电流设计适合电池供电或低功耗系统。
- 宽温度范围与较小温漂（±300 ppm/℃）确保在工业级环境下稳定工作。
四、典型应用场景
- 音频系统的电子音量或增益调节
- 显示器亮度/对比度的数字校准
- 自动校准与偏置调整（传感器补偿、零点校正）
- 调试或生产线上的可编程微调（代替机械多圈电位器）
- 低功耗嵌入式设备中的可编程阻抗网络
五、设计与使用建议
- 在系统设计中确保控制脉冲满足器件时序要求：CS、INC 与 U/D 信号的建立与保持时间。
- 每步约 500 Ω，为避免超出器件功耗限制，应限定经 A-B 端和滑动端的电流；若应用中会有较大通过电流，应在数据手册中确认最大通过电流并考虑并联或外部缓冲。
- 由于阻值公差较大（±20%），在需要高精度阻值的场合应配合后端校准或使用更高精度器件。
- 注意电源稳定性：工作在 4.5 V ~ 5.5 V 电压区间内，避免超压或反向供电。
六、包装与可获性
X9C503SIZT1 采用标准 SOIC-8 贴片封装，适合自动贴装与回流焊流程。作为 RENESAS 品牌产品，可通过正规分销渠道获取，采购时请关注产品批次与原厂规格书以确保时序与极限参数的一致性。
如需进一步的电气特性曲线、引脚排布或推荐驱动时序，请提供是否需要我为您检索并整理该型号的详细数据手册关键页或典型接线图。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
