Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
R5F572MDDDFP#10 为瑞萨(RENESAS)RXv3 架构的高性能 32 位微控制器,面向需要大容量程序存储与强劲运算能力的嵌入式应用。器件封装为 LQFP-100(14 x 14 mm),工作电压范围 2.7V 至 3.6V,工作温度覆盖 -40℃ 至 +85℃,适合工业级应用环境。
该器件以 RXv3 内核和 240 MHz 的主频提供充足的处理头寸,配合 2 MB 的 FLASH 与 1 MB 的 RAM,可用于运行复杂控制算法、实时数据缓冲和较大规模的应用固件。32 KB 的 EEPROM 为参数存储或小量持久化数据提供便利。72 路 I/O 足以满足多通道传感器、驱动与通信总线的并行连接需求。内置振荡器有助于简化时钟设计与缩短开发周期。
作为瑞萨 RX 系列的一员,通常可获得官方的软件开发工具链与调试器支持,包括 e2 studio、Renesas Compiler、GCC for Renesas(视许可)及官方固件库与示例代码。建议在产品开发初期查看瑞萨官网的器件资料与应用笔记,以获取中断控制、外设驱动与功耗优化等实践建议。
R5F572MDDDFP#10 在处理能力、存储容量与 I/O 资源上具备较强的平衡性,适合对性能、可靠性有较高要求的中高端嵌入式应用。设计时应关注电源完整性、时钟精度和散热约束,并参照瑞萨官方数据手册与参考设计进行引脚分配与外设选择。若项目对某类外设(如高分辨率 ADC、特定总线接口)有硬性需求,务必核对完整数据表以确认支持情况。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products