Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
RENESAS SLG46824V
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
16
specifications
Core information
- Product name
- RENESAS SLG46824V
- Type
- RENESAS
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- RENESAS
- Electronic Component
- SLG46824V
- Electronic Component
- 1
- Package
- STQFN-20(2x3)
- Type
- Other PLD
- Electronic Component
- Programmable Logic Device (CPLD / FPGA)
- Electronic Component
- 0.017g
- Electronic Component
- 1
- Electronic Component
- BM0264897065
- Operating Temperature
- 40℃~+85℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SLG46824V 产品概述
一、产品简介
SLG46824V 是瑞萨（Renesas）旗下的一款可编程混合信号逻辑器件（其它 PLD 类别），以小封装、高集成度和低功耗为设计目标。器件工作温度范围为 -40℃ 到 +85℃，适用于工业级和消费类环境。封装为 STQFN-20（2x3mm），适合空间受限的 PCB 布局与手持设备应用。典型用途是替代离散逻辑、电平移位器和简单微控制器的部分功能，通过厂商图形化设计工具实现快速配置与非易失性存储。
二、主要特性
- 可编程逻辑与模拟混合模块，支持定制的组合/时序逻辑功能；
- 小体积 STQFN-20（2x3mm）封装，便于高度集成设计；
- 工业温度等级（-40℃~+85℃），可靠性较高；
- 低功耗特性，适合电池供电场合；
- 支持厂商提供的可视化配置工具，设计后置入内部非易失性存储（具体编程接口与供电电压请参照数据手册）。
三、典型应用场景
- 电源管理与上电序列控制、复位与看门狗功能替代；
- GPIO 融合、信号整形、去抖动、脉宽调制（PWM）与时钟生成；
- LED 驱动、开关控制、电平移位与接口隔离；
- 传感器前端信号处理、模拟比较与阈值检测；
- 在空间与成本受限的产品中，用以合并离散器件、减少BOM。
四、封装与热、电注意事项
STQFN-20（2x3mm）封装对焊盘设计与散热有特殊要求：建议在 PCB 上提供底部焊盘/热焊盘并接地，通过可焊铜面改善热传导。贴片时注意湿度敏感级别（参考器件包装说明）与回流曲线。电气设计上建议在 VDD 近侧放置 0.1µF 陶瓷去耦，保持信号走线最短并区分模拟/数字地线。具体电压范围、IO 耐压与功耗请以官方规格书为准。
五、开发与评估建议
使用瑞萨提供的设计工具（如 GreenPAK Designer 或对应配置软件）进行原型开发，先在仿真环境验证逻辑与时序，再下载到评估板或样片测试。测试要覆盖温度、供电波动与电磁兼容场景，测量静态与动态功耗，确认 IO 驱动能力和上电/掉电顺序。必要时索取评估板或样片以缩短开发周期。
六、选型与替代建议
若需要更多逻辑资源或复杂外设，可考虑更大规格的可编程逻辑器件或低端 MCU；若目标是极低功耗与最小外形，SLG46824V 是优选之一。最终选型应综合功能需求、IO 电平、封装可行性及成本，并以官方数据手册为准进行最后核对。
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