WMSIC Electronic Components

RENESAS AT45DB161E-SSHF-T AT45DB161E

ModelAT45DB161E-SSHF-T
PackageSOIC-8
BrandRENESAS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RENESAS AT45DB161E-SSHF-T
Type
RENESAS
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RENESAS
Electronic Component
AT45DB161E-SSHF-T
Electronic Component
1
Package
SOIC-8
Electronic Component
NOR FLASH
Electronic Component
0.001g
Electronic Component
1
Electronic Component
BM0264843418
Electronic Component
16.5Mbit
Operating Voltage
2.3V~3.6V
Current
7mA
Interface Type
SPI
Electronic Component
100000
Clock Frequency(fc)
85MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AT45DB161E-SSHF-T 产品概述

一、产品简介

AT45DB161E-SSHF-T 是瑞萨(RENESAS)家族中面向嵌入式存储的串行 NOR DataFlash 器件,标称存储容量 16.5Mbit,内部组织为 4096 Pages × 528 Byte。器件采用标准 SPI 接口,支持高达 85MHz 的时钟频率,工作电压范围宽(2.3V ~ 3.6V),并以 SOIC-8 封装提供,适合工业与消费类电子中对非易失性大页写入与快速读取的需求。

二、主要参数(关键规格)

  • 接口类型:SPI(兼容标准 SPI 指令及时序)
  • 存储容量:16.5Mbit(组织:4096 pages × 528 bytes)
  • 时钟频率 (fc):最高 85MHz
  • 工作电压:2.3V ~ 3.6V
  • 待机电流:7mA(请在系统功耗预算中考虑)
  • 擦写寿命:可达 100,000 次(典型)
  • 数据保留(TDR):20 年
  • 封装:SOIC-8
  • 品牌:RENESAS(瑞萨)

三、器件特点与优势

  • 大页结构:528 字节页结构(含扩展字节),有利于批量写入与快速页编程,适合日志、代码镜像或连续数据写入场景。
  • 高速 SPI:支持高达 85MHz 的 SPI 时钟,读取吞吐高,适合对启动时间和数据传输速率有要求的应用。
  • 高可靠性:擦写寿命达 100k 次、数据保留 20 年,满足工业级长期可靠性需求。
  • 电压兼容性强:2.3V 到 3.6V 的宽工作电压,方便与 3.3V/2.5V 等常见系统电平配合。
  • 标准封装:SOIC-8 便于生产装配与替换,适合 PCB 空间有限但需 DIP 类焊盘的应用。

四、典型应用场景

  • 引导程序与固件存储(Bootloader、系统固件镜像)
  • 数据记录与日志保存(工业控制、仪表、车载记录器)
  • 嵌入式系统配置信息或校准数据保存
  • 消费类电子的非易失性扩展存储(如音频、图像元数据)
  • 需要高写入可靠性与长期数据保持的场合

五、设计建议与注意事项

  • 时序与电源:在高频 SPI 工作下,注意 PCB 布线、地线回路及去耦电容以保证信号完整性与稳定性。建议在 VCC 端布置适当的旁路电容(如 0.1μF + 1μF)。
  • 待机电流规划:规格中待机电流为 7mA,请在系统待机/省电模式设计时核实实际模式电流(不同工作模式差异较大),必要时使用片选或电源控制来降低系统待机功耗。
  • 擦写管理:尽量采用页或扇区对齐写入,避免频繁单字节擦写以延长寿命;可在上层实现磨损均衡与坏块管理策略。
  • 数据完整性:对关键数据建议配合校验(CRC)或冗余机制,特别是在发生写入中断或电源异常时,能减少损坏风险。
  • 指令集兼容:器件实现了 DataFlash 系列的常用命令,开发时参考厂商数据手册确认具体命令序列与寄存器设置。

六、封装与采购信息

  • 封装形式:SOIC-8,适合自动化贴装及手工焊接两种场景。
  • 供应与替代:型号为 AT45DB161E-SSHF-T,品牌为 RENESAS(瑞萨)。采购时请核对批次型号与温度等级,并参考瑞萨最新数据手册以获取完整电气特性与时序规范。

总结:AT45DB161E-SSHF-T 以其大页结构、高速 SPI 支持与良好的擦写寿命与数据保留特性,适合对容量、速度与可靠性有综合要求的嵌入式存储应用。设计时结合电源管理、写入策略与信号完整性优化,可获得稳定且长期可靠的存储表现。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.