WMSIC Electronic Components

RENESAS X9C104SIZT1

ModelX9C104SIZT1
Package8-SOIC
BrandRENESAS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RENESAS X9C104SIZT1
Type
RENESAS
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RENESAS
Electronic Component
X9C104SIZT1
Electronic Component
1
Package
8-SOIC
Electronic Component
positions
Electronic Component
±20%
Electronic Component
0.261g
Electronic Component
100kΩ
Electronic Component
100
Electronic Component
1
Channel Count
1
Features
Electronic Component
Electronic Component
BM0263504366
Operating Temperature
40℃~+85℃
Operating Voltage
5V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

X9C104SIZT1数字电位器产品概述

X9C104SIZT1是瑞萨电子(RENESAS)推出的一款单通道数字电位器,凭借简单的串行控制接口、宽温度范围和小封装设计,广泛适配音频调节、仪器校准、工业控制等场景,是替代传统机械电位器的高性价比选择。

一、核心参数概览

X9C104SIZT1的核心参数清晰明确,满足基础数字调节需求:

  • 阻值范围:100kΩ(固定总阻值,抽头线性均匀分布);
  • 抽头数量:100抽头,分辨率为100kΩ÷100=1kΩ/步,可实现线性连续调节;
  • 通道数:单通道,适配单路参数调节场景;
  • 精度指标:初始精度±20%(典型值),温度系数±300ppm/℃,阻值稳定性可控;
  • 工作电压:5V直流电源(无需额外电压转换);
  • 工作温度:-40℃~+85℃,覆盖工业级和商业级环境;
  • 封装形式:8引脚小外形集成电路(8-SOIC),表面贴装设计。

二、封装与接口特性

1. 封装优势

8-SOIC封装尺寸紧凑(典型尺寸约5.2mm×4.0mm),适合高密度PCB布局,同时支持自动贴装(SMT)工艺,降低生产难度。引脚定义包括电源(Vcc、GND)、控制端(CS、INC、U/D)、电阻端(RH、RW、RL),布局简洁易识别,无需额外引脚扩展。

2. 控制接口

采用U-D-INC-CS串行接口(上/下-递增-片选),无需复杂的SPI/I2C协议,仅需3个MCU IO口即可实现抽头位置控制:

  • CS(片选):低电平有效,选中目标芯片(多芯片级联时需配合不同CS引脚);
  • U/D(方向):高电平为抽头递增,低电平为抽头递减;
  • INC(递增):上升沿触发抽头位置切换,每触发一次切换一个抽头。 该接口降低了MCU资源占用,适合低复杂度的数字控制系统,无需额外通信协议配置。

三、典型应用场景

X9C104SIZT1的参数特性匹配多类场景:

  1. 音频设备音量调节:单通道设计可直接替代机械音量电位器,避免触点氧化、磨损问题,通过数字控制实现精准音量调节(如便携式音箱、耳机放大器、车载音频系统);
  2. 仪器仪表校准:100抽头的线性调节满足基础校准需求(如万用表、压力传感器信号调理电路、温度控制器);
  3. 工业控制参数设置:-40℃~+85℃宽温范围适配工业现场,可用于电源模块电压微调、PLC辅助参数设置、电机驱动增益调节;
  4. 消费电子增益调节:小封装适合手机、平板等便携式设备的音频增益调节,提升产品音质一致性,同时减少机械结构空间占用。

四、性能优势解析

  1. 低复杂度控制:无需SPI/I2C协议,仅需3个IO口即可控制,简化电路设计和软件编程;
  2. 宽温可靠性:工业级温度范围满足户外、车间等极端环境,温度变化对阻值的影响可控(±300ppm/℃),适合长期稳定运行;
  3. 无磨损长寿命:数字控制替代机械触点,避免氧化、磨损问题,寿命远超传统电位器(典型寿命>100万次调节);
  4. 小封装高集成:8-SOIC封装节省PCB空间,适合小型化设备(如可穿戴设备、小型传感器模块);
  5. 成本效益高:成熟的X9C系列产品,性价比优于高精度数字电位器,满足基础调节需求的同时控制BOM成本。

五、使用注意事项

  1. 电源匹配:必须使用5V直流电源,禁止超压(最大绝对电压6V),避免芯片损坏;
  2. 抽头分辨率:1kΩ/步的分辨率不适合高精度调节(如医疗设备、精密仪器),需根据需求选择更高抽头数的型号;
  3. 时序要求:INC上升沿触发前需确认U/D电平稳定,CS需保持低电平期间有效,避免误操作导致抽头位置跳变;
  4. 焊接工艺:8-SOIC为表面贴装,需采用回流焊工艺,避免手工焊接时的引脚桥接或虚焊;
  5. 精度验证:初始精度±20%,若需更高精度需在使用前通过校准电路验证阻值一致性。

X9C104SIZT1作为瑞萨经典数字电位器,以简洁的控制方式、可靠的性能和高性价比,成为基础数字调节场景的优选器件,广泛应用于消费电子、工业控制、仪器仪表等领域。

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