WMSIC Electronic Components

RENESAS HIP2211FR8Z-T HIP2211FR8Z

ModelHIP2211FR8Z-T
PackageDFN-8-EP(4x4)
BrandRENESAS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 23+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RENESAS HIP2211FR8Z-T
Type
RENESAS
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RENESAS
Electronic Component
HIP2211FR8Z-T
Electronic Component
1
Package
DFN-8-EP(4x4)
Electronic Component
(UVP)
Electronic Component
Gate Driver IC
Electronic Component
1g
Electronic Component
1
Features
Built-in Diode
Electronic Component
BM0264684464
Operating Temperature
40℃~+125℃
Operating Voltage
6V~18V
Load Type
MOSFET
Driver
Electronic Component
Current(IOH)
3A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HIP2211FR8Z-T 栅极驱动器 产品概述

一、产品简介

HIP2211FR8Z-T 是瑞萨(RENESAS)面向半桥功率级的双通道栅极驱动器,专为驱动功率MOSFET设计,适用于各种中低电压功率转换和电机驱动场合。器件集成了多项保护与控制功能,兼顾高瞬态驱动能力与低静态功耗,适合空间受限的4×4封装应用。注意不同生产批次或版本的封装标识请以官方数据手册为准。

二、主要电气参数亮点

  • 驱动配置:半桥,驱动负载类型为MOSFET,双通道输出。
  • 驱动能力:灌电流 (IOL) 峰值 4A,拉电流 (IOH) 峰值 3A,可满足快速充放电栅极电容的需求。
  • 速度性能:上升时间 tr ≈ 20ns,下降时间 tf ≈ 20ns;传播延迟 tpLH / tpHL 均约 15ns,有利于高速开关控制与准确时序。
  • 工作电源:VCC 工作电压范围 6V ~ 18V,适配常见半桥供电电压。
  • 静态功耗:静态电流 Iq ≈ 390μA,在待机或闭锁时有利于降低系统待机能耗。
  • 输入门限:输入高电平 VIH 范围 1.84V ~ 2.35V,输入低电平 VIL 范围 1.29V ~ 1.47V,适配3.3V/5V逻辑输入时需核对门限裕量。
  • 工作温度:-40℃ ~ +125℃,适合工业级应用。

三、功能与保护特性

  • 欠压保护 (UVP):当驱动电源低于安全阈值时自动保护,防止栅极误触发。
  • 使能关断功能:可通过使能脚快速关闭驱动输出,便于系统上电/下电管理与故障响应。
  • 内置自举二极管:便于上桥臂高侧供电的自举方案,简化外围电路设计。
  • 交错导通保护(防止重叠导通):芯片内置防止高低侧同时导通的保护逻辑,降低短路风险。
  • 死区时间控制:支持死区时间设定与控制,配合外部或内部控制策略减少导通冲突。

四、典型应用场景

  • 无刷直流电机驱动(BLDC)与电机控制器的半桥/全桥驱动。
  • 同步整流或降压转换器(同步Buck)栅极驱动。
  • AC-DC / DC-DC 功率转换模块中作为高、低侧栅极驱动器。
  • 需要高瞬态驱动能力且空间受限的嵌入式电源系统。

五、使用建议与注意事项

  • 自举电容与驱动旁路电容要靠近器件布局,保证高频充放电电流路径低阻抗。
  • 输入逻辑与器件VIH/VIL门限匹配,若驱动接口来自低电平MCU,需确认高电平裕量或采用电平移位。
  • 根据所驱动MOSFET栅电容选择合适的死区时间与驱动脉宽,避免交越导通或能量损失。
  • 散热与PCB过孔处理:封装为4×4小封装时需通过裸露散热焊盘和多层地铜散热以保证可靠工作。
  • 在设计前请务必参考瑞萨官方数据手册获取完整引脚定义、时序图与典型应用电路,以确保器件选型与系统兼容。

总结:HIP2211FR8Z-T 提供了高瞬态驱动能力、完善的保护机制与工业级温度范围,是半桥MOSFET驱动的可靠选择;在布局、供电与死区/自举设计上给予适当重视,可在电机驱动与电源转换等领域发挥良好性能。

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