WMSIC Electronic Components

RENESAS ISL8002IRZ-T ISL8002IRZ

ModelISL8002IRZ-T
PackageTDFN-8-EP(2x2)
BrandRENESAS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 22+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RENESAS ISL8002IRZ-T
Type
RENESAS
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RENESAS
Electronic Component
ISL8002IRZ-T
Electronic Component
1
Package
TDFN-8-EP(2x2)
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.064g
Electronic Component
1
Features
Output
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0257437679
Operating Temperature
40℃~+125℃@(TJ)
Operating Voltage
2.7V~5.5V
Switching Frequency
1MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ISL8002IRZ-T 产品概述

一、产品简介

ISL8002IRZ-T 是瑞萨(Renesas)旗下的一款降压型开关稳压器(同步整流、可调输出),采用降压拓扑,针对点对点和点对负载的电源转换场景设计。器件输入工作电压范围为 2.7V 至 5.5V,输出电压可调范围从 0.6V 起,最高可达 5.5V,最大连续输出电流 2A。器件集成开关管,工作频率约 1MHz,静态工作电流约 7mA,适合对效率和占板面积有较高要求的中小功率应用。

二、主要特性

  • 降压型(Buck)拓扑,输出可调,最低参考电压 0.6V。
  • 输入电压范围:2.7V ~ 5.5V;输出电压范围:0.6V ~ 5.5V。
  • 最大输出电流:2A(连续)。
  • 集成开关管(内置功率MOSFET),同步整流以降低整流损耗、提升效率。
  • 开关频率:1MHz,有利于使用小尺寸电感与电容,减小电源模块体积。
  • 静态电流(Iq)约 7mA,适用于有待机与运行电流要求的系统。
  • 工作结温范围:-40℃ ~ +125℃(TJ)。
  • 封装:TDFN-8-EP(2x2),带裸露焊盘(exposed pad),便于散热。

三、封装与热管理

ISL8002IRZ-T 采用 8 引脚小型 TDFN(2×2)带裸露焊盘封装,裸露焊盘有利于将损耗通过 PCB 引出并散发。由于器件可输出 2A,PCB 布局应充分考虑散热:短而粗的电流回路、足够面积的地铜箔以及必要的散热通孔(via)以提高热导出效率,保证在高温或大功率输出时器件可靠工作。

四、典型应用场景

  • 电池供电设备的点对点降压(移动终端、便携仪表)。
  • 工业与通信设备的本地电源(MCU、FPGA、传感器供电)。
  • 分布式电源模块、板载稳压后级。
  • 需要小体积、高开关频率和中等功率(约 2A)供电的嵌入式系统。

五、设计要点

  • 电感选择:应选择额定电流高于 2A 且低直流电阻(DCR)的电感,以控制功耗与温升。
  • 输入/输出滤波:在 VIN 与 GND、VOUT 与 GND 附近放置低 ESR 电容以稳定环路与降低纹波。
  • 布局:开关节点(SW)和输入电容、输出电感的回路应尽量短,反馈与参考走线应远离开关噪声源。裸露焊盘需可靠焊接至 PCB 地,以利散热与电流返流。
  • 热裕度与保护:在高环境温度或持续大电流工况下,评估降额与必要的散热措施;若系统需要,可配合外部过流或过温保护电路。

六、产品优势总结

ISL8002IRZ-T 在 2.7V–5.5V 输入范围内提供灵活的 0.6V 起可调输出,1MHz 高频率结合同步整流和内置开关管,使其在体积受限且追求高效率的应用中具吸引力。小型 TDFN-8-EP 封装便于实现高密度布局,同时裸露焊盘有利于热管理与功率扩展,是点对点降压与板载稳压的理想选择。

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