WMSIC Electronic Components

RENESAS R7FA2E1A72DFM#AA0 R7FA2E1A72DFM

ModelR7FA2E1A72DFM#AA0
Package64-LQFP
BrandRENESAS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 21+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
RENESAS R7FA2E1A72DFM#AA0
Type
RENESAS
Unit
Electronic Component
Minimum package
160 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
RENESAS
Electronic Component
R7FA2E1A72DFM#AA0
Electronic Component
1
Electronic Component
DMA,LVD,POR,PWM,WDT
Package
64-LQFP
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
RA2E1
Electronic Component
48MHz
Electronic Component
0g
I / O
56
Electronic Component
Renesas Electronics America Inc
Electronic Component
1
RAM
16K x 8
Electronic Component
32- positions

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

R7FA2E1A72DFM#AA0 产品概述

一、概述

R7FA2E1A72DFM#AA0 是瑞萨(Renesas Electronics America Inc.)RA2E1 系列的 32 位微控制器,基于 ARM® Cortex®-M23 内核,主频 48MHz,面向嵌入式、低功耗和工业控制应用。器件为在售产品,采用 64 引脚 LFQFP(10×10)封装,托盘包装,基本件号 R7FA2E1。

二、存储与内核特性

  • 程序闪存:64KB(64K x 8);
  • EEPROM:4KB(4K x 8)用于非易失性参数存储;
  • SRAM:16KB(16K x 8)用于运行时数据与堆栈;
  • 32 位 ARM Cortex‑M23 内核,48MHz 提供良好的功耗与性能平衡。

三、片上外设与接口

  • 串行通信:I²C、SPI、UART/USART 满足常见外设和传感器连接需求;
  • A/D:13 路 12-bit SAR ADC(13×12b),适合多通道模拟传感器采样;
  • 定时与控制:PWM 外设、DMA、看门狗(WDT);
  • 电源管理:低压检测(LVD)与上电复位(POR)机制,提高系统可靠性;
  • 通用 I/O:56 个可用 I/O,支持多种功能复用。

四、电气与机械特性

工作电压范围宽:1.6V ~ 5.5V,适应电池供电与多种电源拓扑;工作温度范围 -40°C ~ +85°C(TA),适合工业级环境;振荡器类型为外部晶振,封装为表面贴装 64‑LQFP。

五、典型应用场景

适用于工业控制、传感器节点、消费类设备、家电控制、低功耗物联网终端、便携式测量仪表及电机/伺服控制等场合,尤其在对尺寸、成本与功耗有要求且需多模拟通道与丰富通信接口的设计中表现突出。

六、设计与布局建议

  • 电源:为 MCU 核心与外设配置独立去耦电容,注意上电复位及稳压器的软启动;
  • 模拟接口:ADC 引脚与模拟地分离,靠近器件布置采样电阻与滤波;
  • 晶振:外部晶振元件紧靠振荡器引脚布置,减小干扰;
  • 外设保护:对外部通信总线添加防浪涌/ESD 保护,特别是在工业现场应用。

七、采购与封装信息

完整料号:R7FA2E1A72DFM#AA0;封装 64‑LFQFP(10×10);包装类型:托盘;器件状态:在售。基本产品编号:R7FA2E1。

本概述基于器件主要规格与典型应用需求,便于快速评估该 MCU 在项目中的适配性与工程实现要点。若需引脚分配、功耗曲线或评估板资料,可进一步获取数据手册与参考设计。

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