WMSIC Electronic Components

RENESAS AT45DB161E-MHF-T AT45DB161E

ModelAT45DB161E-MHF-T
PackageUDFN-8
BrandRENESAS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 23+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RENESAS AT45DB161E-MHF-T
Type
RENESAS
Minimum package
6000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RENESAS
Electronic Component
AT45DB161E-MHF-T
Electronic Component
1
Package
UDFN-8
Electronic Component
NOR FLASH
Electronic Component
0.1g
Electronic Component
1
Electronic Component
BM0264865106
Electronic Component
16Mbit
Operating Voltage
2.3V~3.6V
Current
25uA
Interface Type
SPI
Electronic Component
100000
Clock Frequency(fc)
85MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AT45DB161E-MHF-T 产品概述

一、产品简介

AT45DB161E-MHF-T 是瑞萨(RENESAS)系列的串行 NOR Flash(DataFlash),容量 16 Mbit(2 MByte),组织为 4096 页 × 512 Byte,每页 512 字节的二进制页结构。器件通过标准 SPI 接口访问,最高工作时钟可达 85 MHz,工作电压范围 2.3 V ~ 3.6 V,采用小型 UDFN-8 封装,适合对体积、功耗和高速通信有较高要求的嵌入式系统。

二、关键规格一览

  • 存储容量:16 Mbit(2 MByte),4096 页 × 512 Byte
  • 接口类型:SPI(标准模式/高速模式,最高 85 MHz)
  • 工作电压:2.3 V ~ 3.6 V(支持 3.3 V 常见系统)
  • 待机电流:25 μA(低功耗待机,便于电池供电设计)
  • 擦写寿命:100,000 次(典型的擦写耐久性)
  • 数据保持(TDR):20 年(典型数据保持能力)
  • 封装:UDFN-8,适合空间受限设计

三、主要特性与优势

  • 页架构与缓冲区操作:器件采用页为单位的读写结构,支持高效的页编程和页面读出,能实现快速的顺序读/写操作,适合固件存储和数据记录用途。
  • 高速 SPI 通信:最高支持 85 MHz 时钟,满足对读写吞吐量有要求的系统,缩短数据传输时间。
  • 低功耗特性:25 μA 待机电流便于低功耗或电池供电设备长时间待机运行,同时在工作模式下也有针对性的功耗控制。
  • 耐用与可靠:100k 次擦写循环和 20 年的数据保存能力,适用于要求长期可靠性的工业与消费类应用。
  • 小尺寸封装:UDFN-8 封装体积小、热性能好,便于在空间受限的 PCB 布局中部署。

四、典型应用场景

  • 固件/引导代码存储:作为主控 MCU 的外部存储器,用于存放引导镜像、可更新固件(支持 OTA 或现场升级)。
  • 数据记录与日志保存:工业数据记录、事件日志、传感器采样数据等,需要周期写入与长期保存的场景。
  • 配置与参数存储:设备配置、校准参数、序列号和安全信息等小量但需长期保留的数据。
  • 工业与物联网终端:适配 3.3 V 单电源的工业控制器、IoT 节点、智能仪表等。

五、设计注意事项与建议

  • 电源与去耦:在 VCC 引脚附近布局 0.1 μF 和 1 μF 去耦电容,减少电源噪声,保证高速 SPI 时序稳定。
  • SPI 时序与信号完整性:85 MHz 的高速通信对 PCB 的走线长度、阻抗匹配与串扰敏感,应尽量缩短 MOSI/MISO/SCLK/CS 走线,使用地平面并考虑阻抗控制。
  • 写保护与硬件接口:使用器件的 WP# 和 HOLD(如有)引脚实现硬件写保护与总线中断控制,防止意外写入或在多设备总线上冲突。
  • 温度与环境:若应用在极端温度或高湿环境下,请参考器件的温度等级与可靠性规范并进行相应的环境保护措施。
  • 固件升级策略:结合页面擦写与缓冲区特性,采用分区管理、冗余存储与校验(CRC)机制,确保升级过程的原子性与容错能力。

总结:AT45DB161E-MHF-T 提供了 16Mbit 的紧凑容量、高速 SPI 访问、低功耗待机以及较高的擦写耐久与数据保持能力,适合嵌入式系统中对可靠性、体积与通信速率有综合要求的存储需求。选型时请结合系统电压、接口频率与封装布局要求进行验证,并在关键应用中做好电源去耦与信号完整性设计。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.